Abstract: An adjustable wafer transfer machine that includes an adjusting mechanism for changing the spacing between adjacent wafers to accommodate placement of the wafers in either a smaller wafer carrier or a larger wafer carrier and a transfer mechanism for transferring the wafers between the smaller wafer carrier and the adjusting mechanism and for transferring the wafers between the larger wafer carrier and the adjusting mechanism. The adjusting mechanism comprises a pair of flat plates disposed parallel to and opposite one another and a plurality of elongated opposing dividers slidably mounted on the plates. The dividers are disposed vertically adjacent to one another at spaced apart intervals and they extend horizontally to support the wafers along a portion of their perimeter. A positioning mechanism is operatively coupled to the dividers for changing the spacing between the dividers and, correspondingly, between the wafers supported on the dividers.

Abstract: A semiconductor wafer transfer machine for transferring first wafers having a first diameter from a first transferor carrier to a first receiver carrier and second wafers having a second diameter different from the first diameter from a second transferor carrier to a second receiver carrier. The wafer transfer machine includes a base plate with a longitudinal axis for placement on the base plate of the transferor carriers and the receiver carriers and a mechanism for transferring wafers contained in the first and second transferor carriers to the first and second receiver carriers, respectively.

Abstract: A adjustable wafer transfer machine that includes an adjusting mechanism for changing the spacing between adjacent wafers to accommodate placement of the wafers in either a smaller wafer carrier or a larger wafer carrier and a transfer mechanism for transferring the wafers between the smaller wafer carrier and the adjusting mechanism and for transferring the wafers between the larger wafer carrier and the adjusting mechanism. The adjusting mechanism comprises a pair of flat plates disposed parallel to and opposite one another and a plurality of elongated opposing dividers slidably mounted on the plates. The dividers are disposed vertically adjacent to one another at spaced apart intervals and they extend horizontally to support the wafers along a portion of their perimeter. A positioning mechanism is operatively coupled to the dividers for changing the spacing between the dividers and, correspondingly, between the wafers supported on the dividers.

Abstract: A semiconductor wafer transfer machine for transferring first wafers having a first diameter from a first transferor carrier to a first receiver carrier and second wafers having a second diameter different from the first diameter from a second transferor carrier to a second receiver carrier. The wafer transfer machine includes a base plate with a longitudinal axis for placement on the base plate of the transferor carriers and the receiver carriers and a mechanism for transferring wafers contained in the first and second transferor carriers to the first and second receiver carriers, respectively.