Abstract: A cable connector assembly includes a connector housing, a plurality of connection terminals, a plurality of cables, and an organizer. The plurality of connection terminals are arranged in the connector housing. Each of the plurality of cables includes at least one pair of signal wires. The organizer is arranged between the plurality of connection terminals and the plurality of cables. The signal wires of the plurality of cables are connected to the corresponding connection terminals at the organizer.

Abstract: A package module includes an interposer, a plurality of semiconductor dies on the interposer, a module stiffener on the interposer adjacent to the plurality of semiconductor dies, and a molding material layer on the interposer around the plurality of semiconductor dies and the module stiffener.

Abstract: A cable connector assembly includes a connector having a first housing, a plurality of first connection terminals disposed in the first housing, a second housing, and a plurality of second connection terminals disposed in the second housing. The cable connector includes a plurality of cables respectively connected to the first connection terminals and a printed circuit board to which the second connection terminals are connected.

Abstract: An electrical connector comprises an outer housing, an insulating housing installed on the outer housing, a pair of terminal assemblies, and a shielding member. The terminal assemblies are installed in the insulating housing and are spaced apart from each other in a first direction to define an insertion space therebetween adapted to receive a connection terminal of a mating connector. Each terminal assembly includes a plurality of conductive terminals arranged in rows in a second direction perpendicular to the first direction. The plurality of conductive terminals of each terminal assembly include a signal terminal and a ground terminal. The shielding member is positioned at least partially between the two terminal assemblies in the first direction and includes a contact arm in electrical contact with the ground terminal.

Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

Abstract: A semiconductor structure may include an interposer including on-interposer bump structures, at least one semiconductor die bonded to a first subset of the on-interposer bump structures through first solder material portions, at least one spacer die bonded to a second subset of the on-interposer bump structures through second solder material portions, and a molding compound die frame laterally surrounding each of the at least one semiconductor die and the at least one spacer die. Each of the at least one semiconductor die includes a respective set of transistors and a respective set of metal interconnect structures. Each of the at least one spacer die is free from any transistor therein.

Abstract: A connector assembly comprises a circuit board having a front side and a back side, and two first connectors mounted side by side on the front side of the circuit board. A cable includes a plurality of wires divided into two groups, with each of the groups of wires being electrically connected on one end to a respective one of the first connectors via the circuit board.

Abstract: A connector assembly comprises a circuit board having a front side and a back side, and two first connectors mounted side by side on the front side of the circuit board. A cable includes a plurality of wires divided into two groups, with each of the groups of wires being electrically connected on one end to a respective one of the first connectors via the circuit board.

Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

Abstract: The present invention is directed to a photo-curable composition for use in additive manufacturing, said composition comprising, based on the total weight of the composition: from 10 to 80 wt. % of a) a dispersion of nanosilica particles in epoxy resin, said nanosilica particles having an average particle size (d50) of less than 50 nm, as measured by dynamic light scattering; from 10 to 80 wt. % of b) a toughened epoxy resin comprising i) core shell rubber particles; and, ii) at least one cycloaliphatic epoxy resin; and, from 0.1 to 10 wt. % of c) a photoinitatior, said photoinitator comprising an ionic photoacid generator.

Abstract: Treatment delivery apparatuses include a treatment administration device, a multi-lumen catheter reversibly couplable with the treatment administration device, and a controller. The treatment administration device has a housing cartridge-pump interfaces disposed within the housing, each cartridge-pump interface being reversibly couplable with a medication cartridge type. The treatment administration device further includes pumps disposed within the housing, each pump being in fluidic connection with at least one cartridge-pump interface. The controller enables the treatment administration device to: receive a treatment selection, determine available medications based upon medication cartridges coupled with the cartridge-pump interfaces, and administer a treatment to the multi-lumen catheter, based at least upon the treatment selection.

Abstract: Acoustic imaging based on angular coherence is provided. The target is insonified with collimated acoustic beams at several different incidence angles. The resulting images are processed to determine angular coherence averaged over angle, and then integration of the angular coherence for relatively small angular differences is used to provide the output angular coherence image. In cases where flow imaging is done, the images are first filtered to suppress signals from stationary features of the target, multiple acquisitions are acquired, and the final flow image is computed by summing the squares of the angular coherence images (on a pixel by pixel basis).

Abstract: Acoustic imaging based on angular coherence is provided. The target is insonified with collimated acoustic beams at several different incidence angles. The resulting images are processed to determine angular coherence averaged over angle, and then integration of the angular coherence for relatively small angular differences is used to provide the output angular coherence image. In cases where flow imaging is done, the images are first filtered to suppress signals from stationary features of the target, multiple acquisitions are acquired, and the final flow image is computed by summing the squares of the angular coherence images (on a pixel by pixel basis).

Abstract: The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Abstract: The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Abstract: A modeling system enriched with information from a single source (or multiple sources) that allows for the intelligent extension, formulation or reformulation of a request into various processes including but not limited to transmission, discovery, notification, searching, filtering and storing processes is provided. The innovation builds a network of connected information in a specific domain (or group of domains). Additionally, the system enhances the quality and specificity of the results for queries made in various systems including, but not limited to, search engines.

Abstract: A computer system that facilitates presentation of data to a user. A search engine component receives and executes queries on behalf of a user. Results of the query are received and analyzed by an analysis component that filters and organizes the results as a function of relevancy of the data to the user and associated context of the query. A user interface component presents the data to the user in a manner that facilitates easy consumption/processing of data by respective users. The user interface component can dynamically modify display settings as a function of content and type of information displayed, user state, user preferences, explicit or implicit learning, user intent, etc.

Abstract: The invention provides sensor compositions and method of making sensors.

Abstract: A universal system with a unique process is presented to validate the authenticity of a merchandise item using the manufacturer's digital signature embedded in a RFID/smart card tag that is mounted with a merchandise item. This system consists of only the tag reader and the tag and doesn't require complicated mounting methods. New process and methods are devised to allow manufacturers to make and deploy the tags with its own digital signature, and enable buyers not only to validate the authenticity of a merchandise item easily and reliably, but also to check the authenticity of the tag reader itself before the first use.