Abstract: The present disclosure provides a magnetic attraction positioning magnet sheet and a wireless charging module. The magnetic attraction positioning magnet sheet including a plurality of hard magnetic material sheets and a plurality of soft magnetic material sheets spaced apart and arranged in an alternating manner to form an annular positioning magnet sheet. The hard magnetic material sheet can be a magnet sheet (such as a samarium cobalt magnet sheet), the soft magnetic material sheet is at least one selected from an amorphous and/or nanocrystalline magnet sheet, a soft magnetic ferrite magnet sheet, and a soft magnetic alloy sheet. The magnetic attraction positioning magnet sheet can ensure the magnetic alignment between the receiving end and the transmitting end, while reducing or even completely avoiding the interference of the magnetic attraction positioning magnet sheet on the WPC coil, reducing losses, and improving charging efficiency.

Abstract: A semiconductor structure may include an interposer including on-interposer bump structures, at least one semiconductor die bonded to a first subset of the on-interposer bump structures through first solder material portions, at least one spacer die bonded to a second subset of the on-interposer bump structures through second solder material portions, and a molding compound die frame laterally surrounding each of the at least one semiconductor die and the at least one spacer die. Each of the at least one semiconductor die includes a respective set of transistors and a respective set of metal interconnect structures. Each of the at least one spacer die is free from any transistor therein.

Abstract: A package module includes an interposer, a plurality of semiconductor dies on the interposer, a module stiffener on the interposer adjacent to the plurality of semiconductor dies, and a molding material layer on the interposer around the plurality of semiconductor dies and the module stiffener.

Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

Abstract: A semiconductor structure may include an interposer including on-interposer bump structures, at least one semiconductor die bonded to a first subset of the on-interposer bump structures through first solder material portions, at least one spacer die bonded to a second subset of the on-interposer bump structures through second solder material portions, and a molding compound die frame laterally surrounding each of the at least one semiconductor die and the at least one spacer die. Each of the at least one semiconductor die includes a respective set of transistors and a respective set of metal interconnect structures. Each of the at least one spacer die is free from any transistor therein.

Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.

Abstract: The present invention is directed to a photo-curable composition for use in additive manufacturing, said composition comprising, based on the total weight of the composition: from 10 to 80 wt. % of a) a dispersion of nanosilica particles in epoxy resin, said nanosilica particles having an average particle size (d50) of less than 50 nm, as measured by dynamic light scattering; from 10 to 80 wt. % of b) a toughened epoxy resin comprising i) core shell rubber particles; and, ii) at least one cycloaliphatic epoxy resin; and, from 0.1 to 10 wt. % of c) a photoinitatior, said photoinitator comprising an ionic photoacid generator.

Abstract: The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Abstract: The present invention relates to a temporarily bonded adhesive composition used in wafer manufacturing, to the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, an amine and a water soluble polymer.

Abstract: A universal system with a unique process is presented to validate the authenticity of a merchandise item using the manufacturer's digital signature embedded in a RFID/smart card tag that is mounted with a merchandise item. This system consists of only the tag reader and the tag and doesn't require complicated mounting methods. New process and methods are devised to allow manufacturers to make and deploy the tags with its own digital signature, and enable buyers not only to validate the authenticity of a merchandise item easily and reliably, but also to check the authenticity of the tag reader itself before the first use.

Abstract: A multi-band RF architecture including a GSM quadrature modulator for modulating an intermediate frequency (IF) wherein the frequency of the modulated IF signal is changed such that each of the GSM, DCS 1800, and PCS 1900 bands have a respective IF. An intermediate frequency (IF) filter with a pass band that covers the GSM IF, the DCS 1800 IF, and the PCS 1900 IF is connected to the output of the modulator and outputs to a transmit phase lock loop, which translates the IF signal from the IF filter to either a GSM band radio frequency signal, a DCS 1800 band radio frequency signal, or a PCS 1900 band radio frequency signal, depending on the frequency of a local oscillator (LO). The receiver employs a down converter which provides a down converted output signal selected by high side injection for the GSM band an by low side injection for the DCS 1800 and PCS 1900 bands.

Abstract: A dual band RF architecture including a GSM quadrature modulator for modulating an intermediate frequency (IF) wherein the frequency of the modulated IF signal is changed such that one IF is used for the GSM band and another IF is used for the DCS 1800 band. An intermediate frequency (IF) filter with a pass band that covers both the GSM IF and the DCS 1800 IF is connected to the output of the modulator and outputs to a transmit phase lock loop, which translates the IF signal from the IF filter to either a DCS 1800 band radio frequency signal or a GSM band radio frequency signal, depending on the frequency of a local oscillator (LO). The receiver employs a down converter which provides a down converted output signal selected by high side injection for the GSM band an by low side injection for the DCS 1800 band.

Abstract: A frequency synthesizer for generating two or more output frequency ranges using a Phase Locked Loop (PLL) circuit having a single voltage-controlled oscillator (VCO). In a first embodiment, a frequency multiplier is connected to the output of the VCO. The output of the VCO and the output of the frequency multiplier are selectably fed back, depending upon which output frequency is desired. The output frequency may be taken directly from the VCO or the frequency multiplier. When the output frequency is taken from the output of the frequency multiplier, a control signal adjusts the gain of the phase detector and/or loop filter in order to compensate for the loop gain caused by the frequency multiplier. In a second embodiment, instead of adjusting the phase detector and/or loop filter gain, the values of the N and M dividers are adjusted. In a third embodiment, a frequency multiplier is connected to the output of the VCO and multiplies the output by a predetermined multiplier value.

Abstract: The present invention provides increased geographical coverage and system capacity for mobile/portable radio transceivers using adjacent and typically separate radio communication frequency bands. A radio that transceives in just one frequency band is adapted to provide a configurable duplexing arrangement to permit communications in extended frequency bands. Duplexing circuitry is connected between the radio antenna and the radio transmitter and receiver. Depending upon the mode of operation of the radio transceiver, switches are selectively operated for variously configuring the antenna, duplexer circuitry, receiver, and transmitter to permit communications in a first or a second set of transmit/receive frequency bands. In one preferred example embodiment, only a single duplexer is employed connected to the antenna and transceiving circuitry through plural switches.