Patents by Inventor Leo Li

Leo Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250143923
    Abstract: A medical implant is disclosed. The medical implant includes a body having a first end having a first cross-sectional dimension, a second end having a second cross-sectional dimension, and a tapered portion extending between the first end and the second end. The first cross-sectional dimension is larger than the second cross-sectional dimension. In some embodiments, the body comprises multiple layers.
    Type: Application
    Filed: January 7, 2025
    Publication date: May 8, 2025
    Applicant: ALCON INC.
    Inventors: Thomas A. Shepard, Tyler Pegoraro, Stuart Williams, Sanjib Kumar Das, Leo Anthony Trevino, Cheng Li
  • Publication number: 20250136653
    Abstract: The invention provides nucleic acid molecules encoding FGF21 mutant polypeptides, FGF21 mutant polypeptides, pharmaceutical compositions comprising FGF21 mutant polypeptides, and methods for treating metabolic disorders using such nucleic acids, polypeptides, or pharmaceutical compositions.
    Type: Application
    Filed: June 7, 2024
    Publication date: May 1, 2025
    Inventors: Edward John Belouski, Murielle Marie Ellison, Agnes Eva Hamburger, Randy Ira Hecht, Yue-Sheng Li, Mark Leo Michaels, Jeonghoon Sun, Jing Xu
  • Publication number: 20250134243
    Abstract: A cleaning attachment and rotary tool for cleaning are provided. A cleaning attachment includes a housing, a plurality of bristles, and a drive shaft extending from the housing in an axial direction, the drive shaft being coupled to the housing such that rotation of the drive shaft causes rotation of the housing. The housing includes a reservoir, a valve for dispensing the fluid from the reservoir, and at least one resilient element surrounding an axis defined by the drive shaft. Translation of the drive shaft along the axial direction causes compression of the resilient element, and compression of the resilient element causes the valve to open to dispense fluid from the reservoir. A rotary tool for cleaning includes the cleaning attachment and a rotary tool having a motor, power source, and a chuck configured to receive the drive shaft of the cleaning attachment.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 1, 2025
    Inventors: Jeremy Fedrigon, J. Luke Jenkins, Stephen A. Hughett, Ryan Li Hao Yang, Aiden Li Zhang, Leo You Rui Li, Hank Yong Hang Huang, Guo Hua Liang
  • Patent number: 12268633
    Abstract: A medical implant is disclosed. The medical implant includes a body having a first end having a first cross-sectional dimension, a second end having a second cross-sectional dimension, and a tapered portion extending between the first end and the second end. The first cross-sectional dimension is larger than the second cross-sectional dimension. In some embodiments, the body comprises multiple layers.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: April 8, 2025
    Assignee: ALCON INC.
    Inventors: Thomas A. Shepard, Tyler Pegoraro, Stuart Williams, Sanjib Kumar Das, Leo Anthony Trevino, Cheng Li
  • Patent number: 12265980
    Abstract: An online system receives information describing an order placed by a user of the online system and a set of contextual features associated with servicing the order. The online system also retrieves a set of user features associated with the user. The online system accesses a machine learning model trained to predict a tip amount the user is likely to provide for servicing the order and applies the machine learning model to a set of inputs, in which the set of inputs includes the information describing the order, the set of user features, and the set of contextual features. The online system then determines a suggested tip amount for servicing the order based on the predicted tip amount.
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: April 1, 2025
    Assignee: Maplebear Inc.
    Inventors: Shuo Feng, Chia-Eng Chang, Aoshi Li, Pak Hong Wong, Leo Kwan, Mengyu Zhang, Van Nguyen, Aman Jain, Ziwei Shi, Ajay Pankaj Sampat, Rucheng Xiao
  • Publication number: 20250078105
    Abstract: An online system receives information describing an order placed by a user of the online system and a set of contextual features associated with servicing the order. The online system also retrieves a set of user features associated with the user. The online system accesses a machine learning model trained to predict a tip amount the user is likely to provide for servicing the order and applies the machine learning model to a set of inputs, in which the set of inputs includes the information describing the order, the set of user features, and the set of contextual features. The online system then determines a suggested tip amount for servicing the order based on the predicted tip amount.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 6, 2025
    Inventors: Shuo Feng, Chia-Eng Chang, Aoshi Li, Pak Hong Wong, Leo Kwan, Mengyu Zhang, Van Nguyen, Aman Jain, Ziwei Shi, Ajay Pankaj Sampat, Rucheng Xiao
  • Patent number: 12242775
    Abstract: A computer-implemented method executed by one or more processors includes receiving interconnection data for a proposed interconnection to a power grid; accessing a power grid model including a topological representation of the power grid, electrical specifications of grid components, and empirical operation characteristics; and generating, using the interconnection data for the proposed interconnection to the power grid, and the power grid model, simulated power grid data. The simulated power grid data is based on simulating operation of the power grid with the proposed interconnection coupled to a location of the power grid identified by the interconnection data during a simulated time period. The simulated power grid data includes a plurality of different temporal and spatially dependent characteristics of the power grid. The method includes evaluating, using one or more metrics, the simulated power grid data; and outputting evaluation results of the one or more metrics.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: March 4, 2025
    Assignee: X Development LLC
    Inventors: Leo Francis Casey, Xinyue Li, Page Furey Crahan, Raymond Daly, Peter Evans, Xing Chen, Amanda McNary
  • Publication number: 20250064644
    Abstract: A skin closure system includes a surgical mesh dimensioned to surround a wound, a topical skin adhesive that may be applied to an upper side of the surgical mesh to thereby form a protective layer over the wound, and a sensate located on a peripheral area of the surgical mesh such that the senate is spaced a distance away from the wound.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: Julian A. Quintero, Duan Li Ou, Robert J. Tannhauser, Leo B. Kriksunov, Davide Miksa
  • Publication number: 20250065021
    Abstract: A skin closure system includes a surgical mesh, a topical skin adhesive, and a strip that may be secured relative to the surgical mesh. The surgical mesh includes an upper side and a lower side, with the lower side capable of adhering to a section of the patient skin that surrounds a wound. The topical skin adhesive can be applied to the upper side of the surgical mesh and cure within the surgical mesh to form a protective layer over the wound. The strip has an elongated body impregnated with an active pharmaceutical ingredient. The strip extends longitudinally along a central portion of the lower side of the elongated mesh and can diffuse the active pharmaceutical integrated toward the wound after the protective layer is formed over the wound.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: Duan Li Ou, Robert J. Tannhauser, Leo B. Kriksunov
  • Patent number: 12213913
    Abstract: A medical implant is disclosed. The medical implant includes a body having a first end having a first cross-sectional dimension, a second end having a second cross-sectional dimension, and a tapered portion extending between the first end and the second end. The first cross-sectional dimension is larger than the second cross-sectional dimension. In some embodiments, the body comprises multiple layers.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: February 4, 2025
    Assignee: ALCON INC.
    Inventors: Thomas A. Shepard, Tyler Pegoraro, Stuart Williams, Sanjib Kumar Das, Leo Anthony Trevino, Cheng Li
  • Publication number: 20250021884
    Abstract: A machine learning service implements programmatic interfaces for a variety of operations on several entity types, such as data sources, statistics, feature processing recipes, models, and aliases. A first request to perform an operation on an instance of a particular entity type is received, and a first job corresponding to the requested operation is inserted in a job queue. Prior to the completion of the first job, a second request to perform another operation is received, where the second operation depends on a result of the operation represented by the first job. A second job, indicating a dependency on the first job, is stored in the job queue. The second job is initiated when the first job completes.
    Type: Application
    Filed: July 17, 2024
    Publication date: January 16, 2025
    Applicant: Amazon Technologies, Inc.
    Inventors: Leo Parker Dirac, Nicolle M. Correa, Aleksandr Mikhaylovich Ingerman, Sriram Krishnan, Jin Li, Sudhakar Rao Puvvadi, Saman Zarandioon
  • Publication number: 20240429658
    Abstract: A cable connector assembly includes a connector housing, a plurality of connection terminals, a plurality of cables, and an organizer. The plurality of connection terminals are arranged in the connector housing. Each of the plurality of cables includes at least one pair of signal wires. The organizer is arranged between the plurality of connection terminals and the plurality of cables. The signal wires of the plurality of cables are connected to the corresponding connection terminals at the organizer.
    Type: Application
    Filed: June 20, 2024
    Publication date: December 26, 2024
    Applicants: Tyco Electronics (Dongguan) Ltd., Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Lizhou (Leo) Li, Xinjie (David) Zhang, Yongfeng Li
  • Publication number: 20240297087
    Abstract: A package module includes an interposer, a plurality of semiconductor dies on the interposer, a module stiffener on the interposer adjacent to the plurality of semiconductor dies, and a molding material layer on the interposer around the plurality of semiconductor dies and the module stiffener.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 5, 2024
    Inventors: Sheng-Kai CHANG, Chih-Kang Han, Leo Li, Lieh-Chuan Chen, Chien-Li Kuo
  • Publication number: 20240283177
    Abstract: A cable connector assembly includes a connector having a first housing, a plurality of first connection terminals disposed in the first housing, a second housing, and a plurality of second connection terminals disposed in the second housing. The cable connector includes a plurality of cables respectively connected to the first connection terminals and a printed circuit board to which the second connection terminals are connected.
    Type: Application
    Filed: February 20, 2024
    Publication date: August 22, 2024
    Applicant: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Lizhou (Leo) Li, Xinjie (David) Zhang
  • Publication number: 20240178620
    Abstract: An electrical connector comprises an outer housing, an insulating housing installed on the outer housing, a pair of terminal assemblies, and a shielding member. The terminal assemblies are installed in the insulating housing and are spaced apart from each other in a first direction to define an insertion space therebetween adapted to receive a connection terminal of a mating connector. Each terminal assembly includes a plurality of conductive terminals arranged in rows in a second direction perpendicular to the first direction. The plurality of conductive terminals of each terminal assembly include a signal terminal and a ground terminal. The shielding member is positioned at least partially between the two terminal assemblies in the first direction and includes a contact arm in electrical contact with the ground terminal.
    Type: Application
    Filed: November 30, 2023
    Publication date: May 30, 2024
    Applicants: Tyco Electronics Holdings (Bermuda) No. 7 Limited, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Lizhou (Leo) Li, Xinjie (David) Zhang, Kehao (Asroc) Chen, Ching Hsiang Chang
  • Patent number: 11873368
    Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one elastomer modified epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a durometer in accordance with ASTM D2240, of ?45 when cured with diethylene triamine; c) at least one chelate modified epoxy resin; and d) optionally at least one epoxy resin different from said resins a) to c); and, (B) a second component comprising: e) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one Mannich base.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 16, 2024
    Assignee: Henkel AG & Co. KGaA
    Inventors: Chunfu Chen, Leo Li, Chao Wang
  • Publication number: 20230420429
    Abstract: A semiconductor structure may include an interposer including on-interposer bump structures, at least one semiconductor die bonded to a first subset of the on-interposer bump structures through first solder material portions, at least one spacer die bonded to a second subset of the on-interposer bump structures through second solder material portions, and a molding compound die frame laterally surrounding each of the at least one semiconductor die and the at least one spacer die. Each of the at least one semiconductor die includes a respective set of transistors and a respective set of metal interconnect structures. Each of the at least one spacer die is free from any transistor therein.
    Type: Application
    Filed: June 24, 2022
    Publication date: December 28, 2023
    Inventors: Sheng-Kai Chang, Leo Li, Chung-Hsien Hun, Lieh-Chuan Chen, Chien-Li Kuo
  • Patent number: 11735850
    Abstract: A connector assembly comprises a circuit board having a front side and a back side, and two first connectors mounted side by side on the front side of the circuit board. A cable includes a plurality of wires divided into two groups, with each of the groups of wires being electrically connected on one end to a respective one of the first connectors via the circuit board.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: August 22, 2023
    Assignee: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Lizhou (Leo) Li, Xinjie (David) Zhang, Hongjian (Neil) Ni
  • Publication number: 20220059959
    Abstract: A connector assembly comprises a circuit board having a front side and a back side, and two first connectors mounted side by side on the front side of the circuit board. A cable includes a plurality of wires divided into two groups, with each of the groups of wires being electrically connected on one end to a respective one of the first connectors via the circuit board.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 24, 2022
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Lizhou (Leo) Li, Xinjie (David) Zhang, Hongjian (Neil) Ni
  • Patent number: D1012524
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: January 30, 2024
    Inventors: Jianhui Zhou, Bo Wu, Leo Li