Abstract: An ear-worn hearing device is disclose and includes a body portion with a sound-producing transducer acoustically coupled to a sound passage of a nozzle. A physiological or activity sensor is located at a side of the body portion, and a resilient lobe extends from or is disposed at least partially about the body portion. The resilient lobe has greater stiffness on a side of the body portion opposite the side at which the sensor is located, wherein the resilient lobe biases the sensor toward ear tissue when the hearing device is worn by a user.

Abstract: An ear-worn hearing device is disclosed and includes a body portion with a sound-producing transducer acoustically coupled to a sound passage of a nozzle. a resilient portion protrudes from a side of the body portion and includes a physiological or activity sensor coupled to a flexible portion of a flex harness. The resilient portion at least partially covers a portion of the flex harness without impeding operation of the sensor, wherein the flexible portion and the sensor are flexible toward and away from the body portion upon depression and release of the resilient portion.

Abstract: The present invention discloses a holding device for attachment to the ear of a user, wherein a flexible connecting element arranged between an end piece and a terminal holder ensures that, even when subjected to relatively pronounced loads caused by external effects, such as for example a change in position of the head, the holding device is securely held on the ear without exerting unpleasant pressure on individual anatomical structures of the ear. By virtue of a flexible basic structure, the holding device according to the invention enables use on both ears of a user, without the holding device having to be adapted individually to each ear by a change in structure. In addition, a box suitable for storing the holding device ensures safe storage of the holding device when not in use, serves to keep the holding device ready for immediate use, and prevents deformation of the holding device caused by improper storage.

Abstract: The present invention discloses a holding device for attachment to the ear of a user, wherein a flexible connecting element arranged between an end piece and a terminal holder ensures that, even when subjected to relatively pronounced loads caused by external effects, such as for example a change in position of the head, the holding device is securely held on the ear without exerting unpleasant pressure on individual anatomical structures of the ear. By virtue of a flexible basic structure, the holding device according to the invention enables use on both ears of a user, without the holding device having to be adapted individually to each ear by a change in structure. In addition, a box suitable for storing the holding device ensures safe storage of the holding device when not in use, serves to keep the holding device ready for immediate use, and prevents deformation of the holding device caused by improper storage.

Abstract: The invention relates to a system (1) for actuating a lock (2), comprising a function carrier (6), in particular a frame, a door actuating member (7), in particular a door handle, a bearing element (8), which is connected to the function carrier (6) in a torque-proof manner and serves for supporting the door actuating member at the function carrier, and a coupling, which comprises at least one coupling element (15) which is movable from a non-contacting position into a contacting position with a coupling counter-element (3) integrated into the lock (2), wherein, in the non-contacting position of the coupling element (15) with the coupling counter-element (3), the door actuating member (7) is freely rotatable without transferring a torque onto the lock (2), and wherein, in the contacting position of the coupling element (15) with the coupling counter-element (3), a torque applied to the door actuating member (7), is transferable, via the coupling element (15), onto the coupling counter-element (3) and thereby

Abstract: A system including at least one door actuating member, a locking cylinder, and a connecting element connecting the door actuating member and the locking cylinder, which element is configured in one or more pieces and connects the door actuating member and the locking cylinder via a variable distance to each other, wherein the distance between the door actuating member and the locking cylinder can be adjusted via the connecting element.

Abstract: The invention relates to a door actuating member including a housing and a coupling, where the coupling is integrated into the housing.

Abstract: A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality of semiconductor chips which have first contact faces electrically connected to the first conductor track plane, and second contact faces opposite the first sides. The method furthermore includes providing a second substrate which has a second conductor track plane with contact points, securing electrically conductive balls to the contact points of the second conductor track plane using an electrically conductive, flexible adhesive, applying an electrically conductive, flexible adhesive to the second contact faces of the plurality of semiconductor chips, and joining the first substrate and the second substrate together.

Abstract: A power semiconductor array on a direct copper bonding (DCB) semiconductor substrate is created, in which the interference emissions propagated via its terminal lines are eliminated, or at least greatly reduced, directly on the semiconductor device. The power semiconductor array on the DCB substrate includes a first intermediate circuit terminal connected to a positive potential, a second intermediate circuit terminal connected to a negative potential, and at least one load terminal. The power semiconductor array further includes at least two power switches for connecting the load terminal to the first and second intermediate circuit terminals in alternation. The power semiconductor array is characterized by bridging connections that connect at least some of the terminals of the power semiconductor array that lead to the outside to one another in pairs, so that interference circuits within the power semiconductor array are closed.

Abstract: A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality of semiconductor chips which have first contact faces electrically connected to the first conductor track plane, and second contact faces opposite the first sides. The method furthermore includes providing a second substrate which has a second conductor track plane with contact points, securing electrically conductive balls to the contact points of the second conductor track plane using an electrically conductive, flexible adhesive, applying an electrically conductive, flexible adhesive to the second contact faces of the plurality of semiconductor chips, and joining the first substrate and the second substrate together.

Abstract: A microelectronic component of sandwich construction, that includes a first substrate with a first conductor track plane and a second substrate with a second conductor track plane, between which many semiconductor chips are disposed. The contacting of the second conductor track plane to the adjacent surface of the semiconductor chips is effected by fixed contacting means, in particular with the soldered connections, an electrically conductive adhesive, or electrically conductive balls. The microelectronic components of the invention are suitable in particular as power components and can be used for instance in inverters. The invention also relates to a method for producing the microelectronic component.

Abstract: A discretely constructed MOSFET is switched by a voltage applied between gate terminal and source terminal. The source terminal has a self-inductance in which a fast change of the load current induces a considerable voltage which opposes the applied gate-source bias. This opposing voltage is reduced since the source contact is connected to an auxiliary terminal which is largely magnetically decoupled from the source terminal. A control voltage is applied between gate terminal and auxiliary terminal. When a plurality of MOSFETs are connected in parallel, oscillations in the control circuit can thus be effectively suppressed.

Abstract: In a semiconductor arrangement having at least one semiconductor body located on an insulating substrate provided with interconnects, a low-inductance arrangement can be achieved in that the connecting leads are arranged in close proximity to one another and at least partially parallel to one another.