Patents by Inventor Leo Merilo

Leo Merilo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20070210436
    Abstract: An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.
    Type: Application
    Filed: March 10, 2006
    Publication date: September 13, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Dario Filoteo, Leo Merilo, Philip Cablao, Emmanuel Espiritu, Rachel Abinan, Allan Ilagan
  • Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same
    Patent number: 6875634
    Abstract: A method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof as part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: April 5, 2005
    Assignee: ST Assembly Test Services PTE LTD
    Inventors: Il Kwon Shim, Hermes T. Apale, Weddie Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo
  • Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same
    Publication number: 20040180525
    Abstract: A new method and assembly is provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package, these anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
    Type: Application
    Filed: March 18, 2004
    Publication date: September 16, 2004
    Applicant: ST Assembly Test Services Ltd.
    Inventors: Il Kwon Shim, Hermes T. Apale, Weddie Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo
  • Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
    Patent number: 6737298
    Abstract: A new method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: May 18, 2004
    Assignee: St Assembly Test Services Ltd
    Inventors: Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo
  • Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
    Publication number: 20030138994
    Abstract: A new method and assembly is provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package, these anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
    Type: Application
    Filed: January 23, 2002
    Publication date: July 24, 2003
    Applicant: St Assembly Test Services Pte Ltd
    Inventors: Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo