Patents by Inventor Leo Ofman
Leo Ofman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7096580Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.Type: GrantFiled: March 22, 2005Date of Patent: August 29, 2006Assignee: Intel CorporationInventors: Carlos A. Gonzalez, Leo Ofman
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Publication number: 20050161807Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.Type: ApplicationFiled: March 22, 2005Publication date: July 28, 2005Inventors: Carlos Gonzalez, Leo Ofman
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Patent number: 6884943Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.Type: GrantFiled: August 4, 2003Date of Patent: April 26, 2005Assignee: Intel CorporationInventors: Carlos A. Gonzalez, Leo Ofman
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Patent number: 6661660Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.Type: GrantFiled: October 4, 2001Date of Patent: December 9, 2003Assignee: Intel CorporationInventors: Ravi Prasher, Abhay A. Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman, Ajit V. Sathe
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Patent number: 6657131Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.Type: GrantFiled: December 8, 2000Date of Patent: December 2, 2003Assignee: Intel CorporationInventors: Carlos A. Gonzalez, Leo Ofman
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Patent number: 6639799Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.Type: GrantFiled: December 22, 2000Date of Patent: October 28, 2003Assignee: Intel CorporationInventors: Ravi Prasher, Abhay A. Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman, Ajit V. Sathe
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Publication number: 20020080583Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.Type: ApplicationFiled: December 22, 2000Publication date: June 27, 2002Inventors: Ravi Prasher, Abhay A. Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman, Ajit V. Sathe
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Publication number: 20020080584Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.Type: ApplicationFiled: October 4, 2001Publication date: June 27, 2002Applicant: Intel Corporation.Inventors: Ravi Prasher, Abhay A. Watwe, Gregory M. Chrysler, Kristopher Frutschy, Leo Ofman, Ajit V. Sathe
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Publication number: 20020070448Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.Type: ApplicationFiled: December 8, 2000Publication date: June 13, 2002Applicant: Intel CorporationInventors: Carlos A. Gonzalez, Leo Ofman
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Patent number: 4589547Abstract: A carrier (30) for thin flat electronic devices (36) is provided which has a high volumetric efficiency and is adapted for use with automatic handling equipment. The carrier (30) comprising a hollow tube (31) having a longitudinal interior bore (35) in which is placed a longitudinal cage of metal rails (38) which surround, guide, and hold the devices (36) in a stacked relationship. At least six rails (38) are required to avoid binding and jamming of devices (36) in bore (35). End caps (33a-b) and a moveable resilient plug (34) are used to retain the devices (36) firmly but gently in place to prevent chipping and scratching of the devices (36) during handling and shipment of the carrier (30), and to vary the capacity of the carrier (30). The carrier (30) is rugged, reuseable, and has a volumetric efficiency (devices/unit volume) three to eighteen times higher than prior art egg-crate type device carriers.Type: GrantFiled: January 14, 1983Date of Patent: May 20, 1986Assignee: Motorola Inc.Inventors: Timothy C. Stewart, Leo Ofman, Kelvin R. Blair, Randolph M. Gregg