Patents by Inventor Leo Rimpillo

Leo Rimpillo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical curing process for intergrated circuit package assembly
    Patent number: 5846476
    Abstract: In semiconductor device assembly operations, the use of an optical heat source 28, such as a tungsten halogen lamp module, is to replace ovens and heater blocks for curing die-attach material and molding compound with reduction in cycle time, cost, footprint, and contamination.
    Type: Grant
    Filed: May 2, 1997
    Date of Patent: December 8, 1998
    Assignee: Texas Instruments Incorporated
    Inventors: Ming Hwang, Leslie E. Stark, Gail Heinen, Leo Rimpillo