Patents by Inventor Leo Rizzi

Leo Rizzi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS COMPONENT AND METHOD FOR PRODUCING A MEMS COMPONENT
    Publication number: 20260209032
    Abstract: A MEMS component. The MEMS component includes a substrate with a front side and a rear side, a MEMS functional unit arranged on the front side of the substrate, an electrical circuit unit arranged on the rear side of the substrate for applying, receiving and/or processing signals of the MEMS functional unit, and an electrical connection structure extending through the substrate for electrically connecting the MEMS functional unit to the electrical circuit unit. A method for producing such a MEMS component is also described.
    Type: Application
    Filed: January 14, 2026
    Publication date: July 23, 2026
    Inventors: Leo Rizzi, Johannes Boy
  • Micromechanical device comprising a hydrogen drainage layer
    Patent number: 12679721
    Abstract: A micromechanical device. The device includes a MEMS chip which comprises a cavity; an IC chip which includes an IC substrate and at least one IC functional layer, wherein the IC chip is connected to the MEMS chip such that the IC functional layer is disposed between the IC substrate and the cavity. The IC chip includes a hydrogen drainage layer which is disposed between the IC functional layer and the cavity.
    Type: Grant
    Filed: September 11, 2023
    Date of Patent: July 14, 2026
    Assignee: ROBERT BOSCH GMBH
    Inventors: Johannes Boy, Leo Rizzi
  • MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
    Publication number: 20240124296
    Abstract: A micromechanical device. The device includes a MEMS chip which comprises a cavity; an IC chip which includes an IC substrate and at least one IC functional layer, wherein the IC chip is connected to the MEMS chip such that the IC functional layer is disposed between the IC substrate and the cavity. The IC chip includes a hydrogen drainage layer which is disposed between the IC functional layer and the cavity.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 18, 2024
    Inventors: Johannes Boy, Leo Rizzi