Patents by Inventor Leo Salmi

Leo Salmi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS FOR FILLING A GAP FEATURE ON A SUBSTRATE SURFACE AND RELATED SEMICONDUCTOR STRUCTURES
    Publication number: 20230170207
    Abstract: A method for filling a gap feature on a substrate surface is disclosed. The method may include: providing a substrate comprising a non-planar surface including one or more gap features; depositing a metal oxide film over a surface of the one or more gap features by a cyclical deposition process; contacting the metal oxide with an organic ligand vapor; and converting at least a portion of the metal oxide film to a porous material thereby filling the one or more gap features. Semiconductor structures including a metal-organic framework material formed by the methods of the disclosure are also disclosed.
    Type: Application
    Filed: December 12, 2022
    Publication date: June 1, 2023
    Inventors: Leo Salmi, Mikko Ritala, Markku Leskelä
  • Methods for filling a gap feature on a substrate surface and related semiconductor structures
    Patent number: 11527403
    Abstract: A method for filling a gap feature on a substrate surface is disclosed. The method may include: providing a substrate comprising a non-planar surface including one or more gap features; depositing a metal oxide film over a surface of the one or more gap features by a cyclical deposition process; contacting the metal oxide with an organic ligand vapor; and converting at least a portion of the metal oxide film to a porous material thereby filling the one or more gap features. Semiconductor structures including a metal-organic framework material formed by the methods of the disclosure are also disclosed.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: December 13, 2022
    Assignee: ASM IP Holding B.V.
    Inventors: Leo Salmi, Mikko Ritala, Markku Leskelä
  • METHODS FOR FILLING A GAP FEATURE ON A SUBSTRATE SURFACE AND RELATED SEMICONDUCTOR STRUCTURES
    Publication number: 20210193458
    Abstract: A method for filling a gap feature on a substrate surface is disclosed. The method may include: providing a substrate comprising a non-planar surface including one or more gap features; depositing a metal oxide film over a surface of the one or more gap features by a cyclical deposition process; contacting the metal oxide with an organic ligand vapor; and converting at least a portion of the metal oxide film to a porous material thereby filling the one or more gap features. Semiconductor structures including a metal-organic framework material formed by the methods of the disclosure are also disclosed.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 24, 2021
    Inventors: Leo Salmi, Mikko Ritala, Markku Leskelä