Patents by Inventor Leo Shen
Leo Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11933087Abstract: A storage console includes a housing with a storage chamber, two closure members connected to the housing, an actuator movably arranged in the housing and a latch mechanism rotatably connected to the housing. The two closure members can be rotated to open or close the storage chamber. The latch mechanism includes two latch members and a synchronizer connected between the two latch members. The movement of the actuator actuates the two latch members to rotate to a lock position in which the two latch members engage with the two closure members or a release position in which the two latch members are separated from the two closure members. The two closure members of the storage console can be opened synchronously by use of the actuator and closed independently of each other.Type: GrantFiled: February 21, 2022Date of Patent: March 19, 2024Assignee: Ford Global Technologies, LLCInventors: Mona Li, Wei Xu, Leo Chen, Kevin Shen
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Publication number: 20230260949Abstract: A semiconductor device includes a first semiconductor die having a top planar surface and a second semiconductor die having a bottom planar surface and a top planar surface. A protective layer including a bottom planar surface and a top planar surface is positioned between the first semiconductor die and the second semiconductor die. An adhesive layer having a top planar surface and a bottom planar surface is between the protective layer and the second semiconductor die. A periphery of the top planar surface of the first semiconductor die is covered by a periphery of the bottom planar surface of the protective layer after cutting a portion of the protective layer that extended past the periphery of the surface of the first semiconductor die. The protective layer reduces the occurrence of peeling of the second semiconductor die and first semiconductor die coupled to the protective layer.Type: ApplicationFiled: February 16, 2022Publication date: August 17, 2023Applicant: Western Digital Technologies, Inc.Inventors: Joyce Chen, CC Liao, Angela Wang, Panny Chen, Tim Huang, Bo Fu, Leo Shen, JinXiang Huang, Olga Chen
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Patent number: 10666015Abstract: A laser array combining device, which comprises: a laser gain medium array, comprising at least two laser gain units, and each generates a laser beam; a shaping optical system, optical shaping to the laser beams generated by the laser gain medium array, the shaping optical system comprises: a fast axis collimating lens, arranged at an emergent side of the laser gain medium array; a field flattening lens, arranged at an emergent side of the fast axis collimating lens, correcting the field curvature of the shaping optical system; a negative lens, arranged at an emergent side of the field flattening lens; a cylindrical lens, arranged at an emergent side of the negative lens for collimating the laser beams; a dispersing optical unit, arranged at an emergent side of the shaping optical system for diffracting incident laser beams; a partial reflection optical unit, receiving laser beams emitted by the dispersing optical unit.Type: GrantFiled: December 23, 2016Date of Patent: May 26, 2020Assignee: II-VI Suwtech, Inc.Inventors: Shaofeng Zhang, Dashan Li, Jintao Yang, Leo Shen, Xiaobin Sun
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Patent number: 10371223Abstract: A brake device for a linear actuator is provided having a torque transmission mechanism for forward transfer of driving torque and a spring friction mechanism for blocking backward transfer of load torque. The mechanism provides an input shaft and a first coupled claw connected to the input shaft that rotates synchronously therewith, a driving torque output shaft and a second coupled claw connected to the output shaft and capable rotating synchronously therewith. The first coupled claw and second coupled claw are matched and engaged together, and used to transfer driving torque in a forward direction from the input shaft to the output shaft. The spring friction mechanism provides a brake housing and a friction coil spring disposed elastically in a cylindrical inner hole of the brake housing. The friction coil spring formed with end parts at two axial ends for hooking onto the first and second coupled claws.Type: GrantFiled: August 31, 2016Date of Patent: August 6, 2019Assignee: Aktiebolaget SKFInventors: Alberto De Bernardi, Enrico Di Stefano, Ciney Zhang, Leo Shen
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Publication number: 20190214785Abstract: A laser array combining device, which comprises: a laser gain medium array, comprising at least two laser gain units, and each generates a laser beam; a shaping optical system, optical shaping to the laser beams generated by the laser gain medium array, the shaping optical system comprises: a fast axis collimating lens, arranged at an emergent side of the laser gain medium array; a field flattening lens, arranged at an emergent side of the fast axis collimating lens, correcting the field curvature of the shaping optical system; a negative lens, arranged at an emergent side of the field flattening lens; a cylindrical lens, arranged at an emergent side of the negative lens for collimating the laser beams; a dispersing optical unit, arranged at an emergent side of the shaping optical system for diffracting incident laser beams; a partial reflection optical unit, receiving laser beams emitted by the dispersing optical unit.Type: ApplicationFiled: December 23, 2016Publication date: July 11, 2019Applicant: II-VI Suwtech, Inc.Inventors: Shaofeng ZHANG, Dashan LI, Jintao YANG, Leo SHEN, Xiaobin SUN
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Patent number: 9914068Abstract: The toy structure kit includes an accessory defining an opening, a toy structure defining an opening, and a connector having a base member and a collar, the connector configured to couple the accessory to the toy structure, the base member including a first projection member and a second projection member, the first projection member configured to extend through the opening defined by the accessory and receive the collar, the second projection member configured to extend through the opening defined by the toy structure.Type: GrantFiled: September 12, 2014Date of Patent: March 13, 2018Assignee: Mattel, Inc.Inventors: Ethan K. Wood, Rawn Trinidad, Nicole Luo, Tai To Lee, Xuan Liang, Leo Shen, Chun Kit Ho
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Publication number: 20170304740Abstract: The toy structure kit includes an accessory defining an opening, a toy structure defining an opening, and a connector having a base member and a collar, the connector configured to couple the accessory to the toy structure, the base member including a first projection member and a second projection member, the first projection member configured to extend through the opening defined by the accessory and receive the collar, the second projection member configured to extend through the opening defined by the toy structure.Type: ApplicationFiled: September 12, 2014Publication date: October 26, 2017Inventors: Ethan K. WOOD, Rawn TRINIDAD, Nicole LUO, Tai To LEE, Xuan LIANG, Leo SHEN, Chun Kit HO
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Patent number: 9636595Abstract: An articulating toy figure having a body and one or more body segments coupled to the body. The one or more body segments are each independently and translationally movable between a first position proximal to the body and a second position distal to the body. One or more detents are provided to secure the position of the one or more body segments in one of the first and second positions. The one or more body segments are each movable between the first and second position by applying a force on the one or more body segments that overcomes the biasing force of the one or more detents. The one or more body segments may be selected from the group consisting of a head, an arm, a leg, and a tail.Type: GrantFiled: September 25, 2015Date of Patent: May 2, 2017Assignee: Mattel, Inc.Inventors: Leo Shen, Toby Zeng, Kar Wah Wong, Josiah T. S. Li, Matthew D. Press
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Publication number: 20170087477Abstract: An articulating toy figure having a body and one or more body segments coupled to the body. The one or more body segments are each independently and translationally movable between a first position proximal to the body and a second position distal to the body. One or more detents are provided to secure the position of the one or more body segments in one of the first and second positions. The one or more body segments are each movable between the first and second position by applying a force on the one or more body segments that overcomes the biasing force of the one or more detents. The one or more body segments may be selected from the group consisting of a head, an arm, a leg, and a tail.Type: ApplicationFiled: September 25, 2015Publication date: March 30, 2017Inventors: Leo SHEN, Toby ZENG, Kar Wah WONG, Josiah T.S. LI, Matthew D. PRESS
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Publication number: 20170058980Abstract: A brake device for a linear actuator is provided having a torque transmission mechanism for forward transfer of driving torque and a spring friction mechanism for blocking backward transfer of load torque. The mechanism provides an input shaft and a first coupled claw connected to the input shaft that rotates synchronously therewith, a driving torque output shaft and a second coupled claw connected to the output shaft and capable rotating synchronously therewith. The first coupled claw and second coupled claw are matched and engaged together, and used to transfer driving torque in a forward direction from the input shaft to the output shaft. The spring friction mechanism provides a brake housing and a friction coil spring disposed elastically in a cylindrical inner hole of the brake housing. The friction coil spring formed with end parts at two axial ends for hooking onto the first and second coupled claws.Type: ApplicationFiled: August 31, 2016Publication date: March 2, 2017Applicant: Aktiebolaget SKFInventors: Alberto De Bernardi, Enrico Di Stefano, Ciney Zhang, Leo Shen
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Patent number: 9533233Abstract: One or more methods, apparatuses, and/or systems are disclosed herein for selectively grasping one or more target objects. The apparatus includes a string and a winding mechanism. The winding mechanism is configured to selectively unwind and wind the string, wherein a first portion of the apparatus is configured to be separated from a second portion of the apparatus when the string is unwound and wherein the first and second portions are configured to be adjacent to one another when the string is wound. A plurality of members are pivotally mounted to the apparatus and operably coupled to the winding mechanism, wherein the plurality of members are configured to grasp an object responsive to actuation of a button that is located within an area defined by the plurality of members.Type: GrantFiled: May 10, 2012Date of Patent: January 3, 2017Assignee: Mattel, Inc.Inventors: J. Austin Rucker, C. Evangelos Kafantaris, Susie E. Buckman, Leo Shen, Roy Hu, Josiah T. S. Li
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Publication number: 20150038047Abstract: A building set and method of play include a base piece and building blocks. The building blocks have an end face and a longitudinal side with planar exterior walls spaced apart at a first width. A first building block has a first connector type with two parallel planar members extending from the end face. The planar members include a rib along an outward face, and are configured to have a snug fit into the first width of another block. A second building block includes a second connector type located on either the end face of the second building block or a top surface of the base. The second connector type has a circular arrangement of pressure hinges, where the other of the end face of the second building block or the top surface of the base has a protrusion configured to be detachably inserted into the pressure hinges.Type: ApplicationFiled: October 8, 2013Publication date: February 5, 2015Applicant: MATTEL, INC.Inventors: Leo Shen, Soon Y. Park, Stephen P.K. Lau, Rawn Trinidad
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Publication number: 20130237123Abstract: One or more methods, apparatuses, and/or systems are disclosed herein for selectively grasping one or more target objects. The apparatus includes a string and a winding mechanism. The winding mechanism is configured to selectively unwind and wind the string, wherein a first portion of the apparatus is configured to be separated from a second portion of the apparatus when the string is unwound and wherein the first and second portions are configured to be adjacent to one another when the string is wound. A plurality of members are pivotally mounted to the apparatus and operably coupled to the winding mechanism, wherein the plurality of members are configured to grasp an object responsive to actuation of a button that is located within an area defined by the plurality of members.Type: ApplicationFiled: May 10, 2012Publication date: September 12, 2013Inventors: J. Austin Rucker, C. Evangelos Kafantaris, Susie E. Buckman, Leo Shen, Roy Hu, Josiah T.S. Li
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Patent number: 7540969Abstract: A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.Type: GrantFiled: December 1, 2006Date of Patent: June 2, 2009Assignee: Subtron Technology Co., Ltd.Inventors: Chung W. Ho, Leo Shen
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Publication number: 20080257590Abstract: A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.Type: ApplicationFiled: February 20, 2008Publication date: October 23, 2008Inventors: Chung W. Ho, Leo Shen
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Publication number: 20070126093Abstract: A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.Type: ApplicationFiled: December 1, 2006Publication date: June 7, 2007Applicant: SUBTRON TECHNOLOGY CO., LTD.Inventors: CHUNG W. HO, LEO SHEN
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Patent number: 7223687Abstract: A method of fabricating a printed wiring board comprising the following steps is provided. A portion of each of two dielectric layers or metal layers bonds to both sides of a carrier plate, respectively. Two build-up wiring structures are respectively formed on the dielectric layers or the metal layers by a build-up process. The portions of the dielectric layers or metal layers bonded to the carrier plate are removed such that the dielectric layers or metal layers and the build-up wiring structures formed thereon are released from the carrier plate to form two printed wiring boards.Type: GrantFiled: August 21, 2006Date of Patent: May 29, 2007Assignee: Subtron Technology Co., Ltd.Inventors: Chung W. Ho, Shih-Lian Cheng, Leo Shen