Patents by Inventor Leo Wai Kay Lau

Leo Wai Kay Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7986481
    Abstract: Provided is a magnetic reproducing method that enables a thin-film magnetic head including a head element for reading data signals which has a noise in its output due to a low temperature to bring out an excellent read characteristic in which the noise is suppressed even under the use environment with the low temperature. The magnetic reproducing method comprises the steps of: heating a head element for reading data signals which has a noise in its output due to a low temperature; and performing a read operation by using the head element for reading data signals under condition that the head element is increased in temperature.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: July 26, 2011
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventors: Noboru Yamanaka, Susumu Nagatsuka, Yoshihiro Kudo, Eric Cheuk Wing Leung, Chris Chiu Ming Leung, Leo Wai Kay Lau, Charles Kin Chiu Wong
  • Patent number: 7872471
    Abstract: Provided is a method for testing a head element that enables proper evaluation of the head element based on a characteristic of the head element under high-temperature and high-stress conditions. The testing method can be performed on a thin-film magnetic head including a head element and a heating element capable of applying a heat and stress to the head element, or performed on a row bar or a substrate wafer on which a plurality of the head elements and a plurality of the heating elements are disposed. The testing method comprises the steps of: causing the heating element to generate heat to apply a heat and stress to the head element; and measuring a characteristic of the head element under the heat and stress to evaluate the head element.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: January 18, 2011
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventors: Noboru Yamanaka, Soji Koide, Yoshiyuki Mizoguchi, Eric Cheuk Wing Leung, Chris Chiu Ming Leung, Leo Wai Kay Lau, Charles Kin Chiu Wong
  • Publication number: 20080049352
    Abstract: Provided is a magnetic reproducing method that enables a thin-film magnetic head including a head element for reading data signals which has a noise in its output due to a low temperature to bring out an excellent read characteristic in which the noise is suppressed even under the use environment with the low temperature. The magnetic reproducing method comprises the steps of: heating a head element for reading data signals which has a noise in its output due to a low temperature; and performing a read operation by using the head element for reading data signals under condition that the head element is increased in temperature.
    Type: Application
    Filed: August 8, 2007
    Publication date: February 28, 2008
    Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.
    Inventors: Noboru YAMANAKA, Susumu NAGATSUKA, Yoshihiro KUDO, Eric Cheuk Wing LEUNG, Chris Chiu Ming LEUNG, Leo Wai Kay LAU, Charles Kin Chiu WONG
  • Publication number: 20080049351
    Abstract: Provided is a method for testing a head element that enables proper evaluation of the head element based on a characteristic of the head element under high-temperature and high-stress conditions. The testing method can be performed on a thin-film magnetic head including a head element and a heating element capable of applying a heat and stress to the head element, or performed on a row bar or a substrate wafer on which a plurality of the head elements and a plurality of the heating elements are disposed. The testing method comprises the steps of: causing the heating element to generate heat to apply a heat and stress to the head element; and measuring a characteristic of the head element under the heat and stress to evaluate the head element.
    Type: Application
    Filed: August 7, 2007
    Publication date: February 28, 2008
    Applicants: TDK CORPORATION, SAE MAGNETICS (H.K.) LTD.
    Inventors: Noboru YAMANAKA, Soji KOIDE, Yoshiyuki MIZOGUCHI, Eric Cheuk Wing LEUNG, Chris Chiu Ming LEUNG, Leo Wai Kay LAU, Charles Kin Chiu WONG