Abstract: A process for the preparation of a sulfonamide-based epoxy resinous composition, which includes the step of reacting a sulfonamide compound with a resinous composition containing a plurality of epoxide groups in the presence of a Lewis acid, is disclosed. The epoxy sulfonamide resins of the invention, which are being claimed, have applications in nail lacquer compositions and other cosmetics, adhesives, and in wood and paper coatings, as a plasticizer and as a modifier in injection molding applications for various resins.