Abstract: A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.

Abstract: A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines opposed, generally planar top and bottom die pad surfaces and a peripheral edge. Connected to and extending between the outer frame portion and the peripheral edge of the die pad is at least one tie bar of the leadframe. The leadframe also includes a plurality of leads which are connected to the outer frame portion and extend into the opening at least partially about the die pad in spaced relation to the peripheral edge thereof. Each of the leads includes opposed, generally planar top and bottom lead surfaces, with at least two of the leads comprising corner leads which extend along opposed sides of the tie bar. Each of the corner leads further defines an angularly offset distal portion which extends along and in spaced relation to the tie bar.

Abstract: An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer contact pad around the die pad, forming an additional outer contact pad around the fishtail tie-bar, and forming an inner contact pad in a staggered position from the outer contact pad, mounting an integrated circuit on the die pad of the QFN leadframe, and attaching a bond wire from the integrated circuit to the additional outer contact pad.

Abstract: A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.

Abstract: A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an outer frame defining a central opening and a die pad disposed within the central opening. Each leadframe further includes a plurality of leads which are attached to the outer frame and extend toward the die pad in spaced relation to each other. The outer frames are integrally connected to each other and collectively define connecting bars which extend in multiple rows and columns and define saw streets. Semiconductor dies are attached to respective ones of the die pads, with the semiconductor dies being mechanically and electrically connected to the leads of respective ones of the leadframes. Thereafter, an encapsulant material is applied to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes, the semiconductor dies, and the conductive wires.

Abstract: A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines opposed, generally planar top and bottom die pad surfaces and a peripheral edge. Connected to and extending between the outer frame portion and the peripheral edge of the die pad is at least one tie bar of the leadframe. The leadframe also includes a plurality of leads which are connected to the outer frame portion and extend into the opening at least partially about the die pad in spaced relation to the peripheral edge thereof. Each of the leads includes opposed, generally planar top and bottom lead surfaces, with at least two of the leads comprising corner leads which extend along opposed sides of the tie bar. Each of the corner leads further defines an angularly offset distal portion which extends along and in spaced relation to the tie bar.