Patents by Inventor Leon Ashley

Leon Ashley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080286287
    Abstract: The present invention discloses the use of modified IGFBP-2 and agents that regulate the interaction between HBD of IGFBP-2 and EC or PC matrix components to prevent cellular proliferation invasion and/or migration (metastases).
    Type: Application
    Filed: March 30, 2006
    Publication date: November 20, 2008
    Applicant: Murdoch Childrens Research Institute
    Inventors: Vincenzo Carlo Russo, George Arthur Werther, Leon Ashley Bach
  • Publication number: 20020035480
    Abstract: A method of performing a selected alternate dispute procedure online comprises the steps of selecting at least one alternate dispute resolution professional and setting up a main chat room accessible by the alternate dispute resolution professional and first and second disputing parties. A private chat room is set up which is accessible by a selected one of the disputing parties and counsel for the selected disputing parties for conducting private information exchanges. A virtual presenter is accessible and the main chat room is activated for presenting evidence. The alternate dispute resolution procedure is then conducted through the exchange of information through chat in the main chat room and the presentation of evidence using the virtual presenter.
    Type: Application
    Filed: June 28, 2001
    Publication date: March 21, 2002
    Inventors: Robert Gordon, Maurine Skeeters, Leon Ashley Peek, Daniel Brookshier
  • Patent number: 6348731
    Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is converted to an intermetallic layer. A layer of copper intermetallics with hafnium, lanthanum, zirconium or tin, is provided to improve the electromigration resistance and to reduce defect sensitivity. A method is also provided to form a cap atop copper lines, to improve corrosion resistance, which fully covers the surface. Structure and methods are also described to improve the electromigration and corrosion resistance by incorporating carbon atoms in copper interstitial positions.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: February 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Leon Ashley, Hormazdyar M. Dalal, Du Binh Nguyen, Hazara S. Rathore, Richard G. Smith
  • Publication number: 20010053967
    Abstract: The present invention relates in general to the field of jury science conducted over a data processing network and in particular to using the Internet to apply a multi-discipline methodology and system to understand legal issues and the judicial process, consideration of those issues, to the understanding of how and why jurors and judges make decisions, and to understanding how, by including the understanding of the impact of this process, justice may be achieved. By applying jury science to the Internet for the first time, this methodology may be applied in a cost affective manner, free from logistical constraints.
    Type: Application
    Filed: January 29, 2001
    Publication date: December 20, 2001
    Inventors: Robert Gordon, Leon Ashley Peek
  • Patent number: 6287954
    Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is converted to an intermetallic layer. A layer of copper intermetallics with hafnium, lanthanum, zirconium or tin, is provided to improve the electromigration resistance and to reduce defect sensitivity. A method is also provided to form a cap atop copper lines, to improve corrosion resistance, which fully covers the surface. Structure and methods are also described to improve the electromigration and corrosion resistance by incorporating carbon atoms in copper interstitial positions.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: September 11, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leon Ashley, Hormazdyar M. Dalal, Du Binh Nguyen, Hazara S. Rathore, Richard G. Smith
  • Patent number: 6130161
    Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is converted to an intermetallic layer. A layer of copper intermetallics with halfnium, lanthanum, zirconium or tin, is provided to improve the electromigration resistance and to reduce defect sensitivity. A method is also provided to form a cap atop copper lines, to improve corrosion resistance, which fully covers the surface. Structure and methods are also described to improve the electromigration and corrosion resistance by incorporating carbon atoms in copper intersititial positions.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: October 10, 2000
    Assignee: International Business Machines Corporation
    Inventors: Leon Ashley, Hormazdyar M. Dalal, Du Binh Nguyen, Hazara S. Rathore, Richard G. Smith