Patents by Inventor Leon Bildusas

Leon Bildusas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged adhesive mass
    Patent number: 6230890
    Abstract: A method for packaging a hot melt adhesive mass comprises providing a hot melt adhesive having a predetermined viscosity and finite size and shape, and encapsulating the hot melt adhesive in a polymeric shrink wrap which forms a hermetic seal thereon. An packaged adhesive mass comprises a hot melt adhesive having a predetermined viscosity and a finite size and shape; and a polymeric shrink wrap film which encapsulates the hot melt adhesive. The hot melt adhesive is hermetically sealed.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: May 15, 2001
    Assignee: Reichhold Chemicals, Inc.
    Inventors: Bruce A. Waver, David E. Mechling, Barclay S. Hickman, Leon Bildusas
  • Method of preparing a hot melt adhesive
    Patent number: 6044625
    Abstract: A method for packaging a hot melt adhesive mass comprises providing a hot melt adhesive having a predetermined viscosity and finite size and shape, and encapsulating the hot melt adhesive in a polymeric shrink wrap which forms a hermetic seal thereon. An packaged adhesive mass comprises a hot melt adhesive having a predetermined viscosity and a finite size and shape; and a polymeric shrink wrap film which encapsulates the hot melt adhesive. The hot melt adhesive is hermetically sealed.
    Type: Grant
    Filed: March 25, 1998
    Date of Patent: April 4, 2000
    Assignee: Reichhold Chemicals, Inc.
    Inventors: Bruce A. Waver, David E. Mechling, Barclay S. Hickman, Leon Bildusas