Abstract: An integrated circuit gas sensor system may include an integrated circuit having a bond pad layer and a dielectric layer formed after the bond pad layer. A conductor layer may be above the dielectric layer. The conductor layer may be utilized to form both gas sensor and humidity sensor conductor patterns, which may be planar. In one embodiment, the gas sensor is combined with a humidity sensor, the gas sensor and the humidity sensor covering more than 50% of the top surface of the integrated circuit. In one embodiment, the central region of the integrated circuit has a majority of its surface area utilized for the sensor structures, and in a more preferred embodiment has more than 80% of its surface area utilized for sensing structures. In one embodiment, resistive sensing may be utilized for the gas sensor and capacitive sensing may be utilized for the humidity sensor.

Abstract: Systems and methods are provided for packaging integrated circuit (IC) gas sensor systems that employ at least one gas sensor that is formed as part of an integrated circuit and configured to sense the presence and/or concentration of a target gas or other gas characteristics that may be present in the ambient gaseous environment surrounding the packaged IC gas sensor system.

Abstract: Gas sensor materials and methods are disclosed for preparing and using the same to produce gas sensor structures. Also disclosed are gas sensor structures and systems that employ these disclosed materials. A gas sense-enhancing metal such as platinum may be added to a gas sensitive metal oxide material in a manner that more highly disperses the added platinum than conventional methods so as to more effectively utilize the platinum at a lower concentration, thus achieving a more cost effective solution. An ink vehicle may also be used for deposition of a gas sensitive material (e.g. on the surface of integrated circuit) that is formulated to allow “burn-out” of ink vehicle components at relatively low temperatures as compared to conventional ink vehicles.

Abstract: Gas sensor materials and methods are disclosed for preparing and using the same to produce gas sensor structures. Also disclosed are gas sensor structures and systems that employ these disclosed materials. A gas sense-enhancing metal such as platinum may be added to a gas sensitive metal oxide material in a manner that more highly disperses the added platinum than conventional methods so as to more effectively utilize the platinum at a lower concentration, thus achieving a more cost effective solution. An ink vehicle may also be used for deposition of a gas sensitive material (e.g. on the surface of integrated circuit) that is formulated to allow “burn-out” of ink vehicle components at relatively low temperatures as compared to conventional ink vehicles.

Abstract: Gas-sensitive materials are disclosed which are mixtures or composites of BaSnO3, and another component comprising one or more phases from the group: CuO, Cr2O3, Fe2O3, MnO, NiO, CoO, Bi2O3, Sb2O3, Sb2O5, WO3, ZnO, and SnO2. The mixture may be modified further by the addition in a highly dispersed manner of fine (less than about 20 nm) particulates of precious metals (Pt, Pd, Au, Ag) to enhance performance. Advantages include: (a) sensitivity in the range 1-2500 ppm NOx typical of combustion environments, (b) reduced humidity influence, (c) repeatability and reliability, and (d) baseline stability over time. In one embodiment, the material includes a mixture of BaSnO3 and CuO such that CuO is present at 25-50 mol %.

Abstract: A gas-sensitive material is disclosed for detecting CO2 for use in semiconductor-based gas sensors. The gas-sensitive material may comprise one or more Ba-containing phases and one or more W-containing phases, at least one of the Ba-containing phases being different than at least one of the W-containing phases; the one or more Ba-containing phases comprising at least one of BaCO3, BaO-rich glass, BaWO4, or any combination thereof; and the one or more W-containing phases comprising at least one of BaWO4, WO3, W(OH)6, or any combination thereof. The material may further comprise one or more oxides selected from the group CuO, Bi2O3, Sb2O3, Sb2O5, La2O3, Cr2O3, Fe2O3, NiO, and TiO2, and any combination thereof. The material may further comprise one or more dopants such as Pt, Pd, Ag, Au or their compounds, and any combination thereof. In one embodiment, the material comprises a mixture of BaO-rich glass, BaWO4, and WO3.