Patents by Inventor Leon Gurevich

Leon Gurevich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4928384
    Abstract: A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.
    Type: Grant
    Filed: October 6, 1989
    Date of Patent: May 29, 1990
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 4926153
    Abstract: A ceramic coating for a subminiature fuse includes sodium silicate and silicon dioxide applied over a subminiature fuse wire in slurry form. The coating gives the fuse arc quenching properties.
    Type: Grant
    Filed: June 2, 1989
    Date of Patent: May 15, 1990
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 4924203
    Abstract: A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, in an insulating enclosure or fuse tube (40). Ferrules (42) are attached to metallized areas (14) with solder (44). Performance and manufacturing of fuse (10) is improved by utilizing a wire bonding technique to improve the quality of the manufacturing process and increase the reliability of the fuse, and to reduce manufacturing cost.
    Type: Grant
    Filed: June 29, 1988
    Date of Patent: May 8, 1990
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 4873506
    Abstract: A fractional amp fuse (10) with a thin film fusible element (16) connecting thick film pads (14) supported by a polished insulating substrate (12). The fuse subassembly has leads (24) attached by resistance welding and is encapsulated in a ceramic insulating material (18). The entire fuse is enclosed in a plastic-like material (20).
    Type: Grant
    Filed: March 9, 1988
    Date of Patent: October 10, 1989
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 4771260
    Abstract: A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.
    Type: Grant
    Filed: March 24, 1987
    Date of Patent: September 13, 1988
    Assignee: Cooper Industries, Inc.
    Inventor: Leon Gurevich
  • Patent number: 4612529
    Abstract: A subminiature fuse is disclosed comprising two terminals, a substrate, a fusible conductor, and a unitary housing. The unitary housing is sealed and provides increased mechanical strength, thus reducing the risk of a catastrophic failure of the fuse. The upper portion of the fuse terminals are shaped into finger like projections adaptable to mechanically fastening the fusible conductor and the substrate thereto thus facilitating the manufacturing process. In one embodiment the fusible conductor and adjacent portions of the terminals and substrate are coated with a ceramic coating or adhesive. The housing is sealed by ultrasonic welding or preferably in an insert molded plastic enclosure which is substantially devoid of air.
    Type: Grant
    Filed: March 25, 1985
    Date of Patent: September 16, 1986
    Assignee: Cooper Industries, Inc.
    Inventors: Leon Gurevich, Vernon Spaunhorst
  • Patent number: RE33137
    Abstract: A subminiature fuse is disclosed comprising two terminals, a substrate, a fusible conductor, and a unitary housing. The unitary housing is sealed and provides increased mechanical strength, thus reducing the risk of a catastrophic failure of the fuse. The upper portion of the fuse terminals are shaped into finger like projections adaptable to mechanically fastening the fusible conductor and the substrate thereto thus facilitating the manufacturing process. In one embodiment the fusible conductor and adjacent portions of the terminals and substrate are coated with a ceramic coating or adhesive. The housing is sealed by utrasonic welding or preferably in an insert molded plastic enclosure which is substantially devoid of air.
    Type: Grant
    Filed: April 17, 1987
    Date of Patent: December 26, 1989
    Assignee: Cooper Industries, Inc.
    Inventors: Leon Gurevich, Vernon R. Spaunhorst