Patents by Inventor Leon Khilchenko

Leon Khilchenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11336060
    Abstract: An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 17, 2022
    Assignee: AMPHENOL CORPORATION
    Inventors: Leon Khilchenko, Mark W. Gailus
  • Publication number: 20190157814
    Abstract: An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: Leon KHILCHENKO, Mark w. GAILUS
  • Patent number: 10186814
    Abstract: An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: January 22, 2019
    Assignee: Amphenol Corporation
    Inventors: Leon Khilchenko, Mark W. Gailus
  • Patent number: 8382524
    Abstract: An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: February 26, 2013
    Assignee: Amphenol Corporation
    Inventors: Leon Khilchenko, Mark W. Gailus
  • Publication number: 20120094536
    Abstract: An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
    Type: Application
    Filed: May 18, 2011
    Publication date: April 19, 2012
    Inventors: Leon KHILCHENKO, Mark W. Gailus
  • Publication number: 20080030970
    Abstract: In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plurality of stacked dielectric layers, with a conductor disposed on at least one of the plurality of dielectric layers. The mating interface includes a plurality of conductive vias aligned in a plurality of rows, with the plurality of conductive vias extending through at least a portion of the plurality of dielectric layers, at least one of the plurality of conductive vias intersecting the conductor. The plurality of conductive vias includes signal conductor connecting conductive vias and ground conductor connecting conductive vias.
    Type: Application
    Filed: June 12, 2007
    Publication date: February 7, 2008
    Inventors: Jason Payne, Mark Gailus, Leon Khilchenko, Huilin Ren
  • Publication number: 20070258223
    Abstract: What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.
    Type: Application
    Filed: July 2, 2007
    Publication date: November 8, 2007
    Inventors: Leon Khilchenko, Mark Gailus
  • Publication number: 20070207635
    Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.
    Type: Application
    Filed: November 27, 2006
    Publication date: September 6, 2007
    Inventors: Mark Gailus, Leon Khilchenko
  • Publication number: 20070205497
    Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.
    Type: Application
    Filed: November 28, 2006
    Publication date: September 6, 2007
    Inventors: Mark Gailus, Leon Khilchenko