Abstract: The present application relates to novel 3?-unsaturated abscisic acid (ABA) derivatives of Formula (I) as ABA antagonists. For example, the present application relates to methods of using compounds of Formula (I) for reducing adverse effects of an ABA response in plants such as lentil and promoting germination. (I) The present application also relates to methods of using 3?-phenyl abscisic acid (ABA) derivatives of Formula (II) as ABA antagonists, for example, for reducing adverse effects of an ABA response in plants such as lentil and promoting germination.

Abstract: Systems, apparatuses, and methods for performing shader writes to compressed surfaces are disclosed. In one embodiment, a processor includes at least a memory and one or more shader units. In one embodiment, a shader unit of the processor is configured to receive a write request targeted to a compressed surface. The shader unit is configured to identify a first block of the compressed surface targeted by the write request. Responsive to determining the data of the write request targets less than the entirety of the first block, the first shader unit reads the first block from the cache and decompress the first block. Next, the first shader unit merges the data of the write request with the decompressed first block. Then, the shader unit compresses the merged data and writes the merged data to the cache.

Abstract: A method and system is provided for allowing signals across electrical domains. The method includes applying a clock signal (of at least 1 GHz) to an electronic element in a location having first electrical properties. Data is output from the first electronic element; and received at a second electronic element located in a location having second electrical properties. The first and second electrical properties are different by either voltage and clock frequency.

Abstract: Systems, apparatuses, and methods for performing shader writes to compressed surfaces are disclosed. In one embodiment, a processor includes at least a memory and one or more shader units. In one embodiment, a shader unit of the processor is configured to receive a write request targeted to a compressed surface. The shader unit is configured to identify a first block of the compressed surface targeted by the write request. Responsive to determining the data of the write request targets less than the entirety of the first block, the first shader unit reads the first block from the cache and decompress the first block. Next, the first shader unit merges the data of the write request with the decompressed first block. Then, the shader unit compresses the merged data and writes the merged data to the cache.

Abstract: A method and system is provided for allowing signals across electrical domains. The method includes applying a clock signal (of at least 1 GHz) to an electronic element in a location having first electrical properties. Data is output from the first electronic element; and received at a second electronic element located in a location having second electrical properties. The first and second electrical properties are different by either voltage and clock frequency.

Abstract: A method and system is provided for allowing signals across electrical domains. The method includes applying a clock signal (of at least 1 GHz) to an electronic element in a location having first electrical properties. Data is output from the first electronic element; and received at a second electronic element located in a location having second electrical properties. The first and second electrical properties are different by either voltage and clock frequency.

Abstract: A method and system is provided for allowing signals across electrical domains. The method includes applying a clock signal (of at least 1 GHz) to an electronic element in a location having first electrical properties. Data is output from the first electronic element; and received at a second electronic element located in a location having second electrical properties. The first and second electrical properties are different by either voltage and clock frequency.

Abstract: A method of forming contact holes is provided. A substrate having a plurality of device structures is provided. A first dielectric layer and a conductive layer sequentially cover the device structures and the surface of the substrate. A recess is formed in the conductive layer between every two neighboring device structures. A pair of composite spacers is formed in the recess. By using the composite spacers as a mask, a portion of the exposed conductive layer is removed to form a plurality of openings between every two neighboring device structures. A second dielectric layer is then formed on the sidewalls of the openings. A third dielectric layer is formed over the substrate. Portions of the third dielectric layer and the first dielectric layer above the openings are removed to form a plurality of self-aligned contact holes.

Abstract: A method of forming contact holes is provided. A substrate having a plurality of device structures is provided. A first dielectric layer and a conductive layer sequentially cover the device structures and the surface of the substrate. A recess is formed in the conductive layer between every two neighboring device structures. A pair of composite spacers is formed in the recess. By using the composite spacers as a mask, a portion of the exposed conductive layer is removed to form a plurality of openings between every two neighboring device structures. A second dielectric layer is then formed on the sidewalls of the openings. A third dielectric layer is formed over the substrate. Portions of the third dielectric layer and the first dielectric layer above the openings are removed to form a plurality of self-aligned contact holes.