Abstract: A measurement system configured to measure a position of an object in a lithographic apparatus, includes at least three position detectors configured to detect the position of the object, the at least three position detectors each including a single or multi-dimensional optical encoder to provide at least six position values, the optical encoders being coupled to the object at different locations within a three dimensional coordinate system, wherein at least one position value is provided for each dimension of the three dimensional coordinate system, and wherein the measurement system is configured to calculate the position of the object within the three dimensional coordinate system from a subset of at least three of the six position values and to calculate an orientation of the object with respect to the three dimensional coordinate system from another subset of at least three of the six position values.

Abstract: Lithographic apparatus includes a substrate table and a motion control system for controlling a movement of the substrate table. The motion control system includes at least 3 position detectors constructed for detecting a position of the substrate table. For measuring a position and orientation of the substrate table, each position detector comprises an optical encoder of a single dimensional or multi dimensional type, the optical encoders being arranged for providing together at least 6 position values, at least one position value being provided for each of the 3 dimensions. 3 or more of the at least 3 optical encoders being connected to the substrate table at different locations in the 3 dimensional coordinate system.

Abstract: A lithographic apparatus is disclosed. The apparatus includes a substrate table constructed to hold a substrate. The substrate table is moveable to transfer the substrate between a substrate measuring position and a substrate processing position. The apparatus also includes a measuring system configured to measure at least one aspect or characteristic of the substrate when the substrate table holds the substrate in the measuring position. The measuring system is configured to direct at least one measuring beam and/or field towards a surface of the substrate. A projection system is configured to project a patterned radiation beam onto a target portion of the substrate when the substrate table holds the substrate in the substrate processing position, and a conditioning system is configured to supply a conditioning fluid to at least part of a path of the measuring beam and/or field of the measuring system to condition the part of the path.

Abstract: The invention is directed to a system and method of monitoring and/or diagnosing tool performance in real-time for system degradation. The invention issues alerts and provides a structured process for identifying the source of the problem and enabling action to be taken before defects are detected on the final product. The invention provides a hierarchical data structure including elements that are monitored based on key performance indicators and diagnostic data sets.

Abstract: A lithographic apparatus includes a position quantity determination system to determine a position quantity of a movable part which is in operation at least partly surrounded by an area comprising a fluid. The position quantity determination system includes an interferometer system, a global sensor to determine a global value of a physical quantity of the fluid in the area, and a local sensor to determine a local value of the physical quantity of the fluid in the part of the area. The position quantity determination system is configured to determine the position quantity from an output of the interferometer, the global value of the physical quantity and the local value of the physical quantity. The physical quantity may include a pressure, a temperature, etc. The local physical quantity determination system may include a sensor, such as a high-speed sensor, a computational fluid dynamics model or a linear approximation model.

Abstract: The invention relates to a lithographic system that includes an illumination system for providing a projection beam of radiation, a mask table for supporting a mask, the mask serving to impart the projection beam with a pattern in its cross-section, a substrate table for holding a substrate, and a projection system for projecting the patterned beam onto a target portion of the substrate. The system also comprises a processor arranged to calculate overlay corrections using a reference height map representing a surface of the substrate table or the mask table. The invention allows feed forward correction of non-flatness induced wafer grid distortion during alignment and during exposure, thereby reducing overlay errors caused by differences in flatness characteristics. It provides an indirect qualification method for overlay accuracy related to exposure chuck flatness based on height map information.

Abstract: Lithographic apparatus includes a substrate table and a motion control system for controlling a movement of the substrate table. The motion control system includes at least 3 position detectors constructed for detecting a position of the substrate table. For measuring a position and orientation of the substrate table, each position detector comprises an optical encoder of a single dimensional or multi dimensional type, the optical encoders being arranged for providing together at least 6 position values, at least one position value being provided for each of the 3 dimensions. 3 or more of the at least 3 optical encoders being connected to the substrate table at different locations in the 3 dimensional coordinate system.

Abstract: Lithographic apparatus includes a substrate table and a motion control system for controlling a movement of the substrate table. The motion control system includes at least 3 position detectors constructed for detecting a position of the substrate table. For measuring a position and orientation of the substrate table, each position detector comprises an optical encoder of a single dimensional or multi dimensional type, the optical encoders being arranged for providing together at least 6 position values, at least one position value being provided for each of the 3 dimensions. Some of the optical encoders may be connected to the substrate table at different locations in the 3 dimensional coordinate system.

Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment subsystem configured to align the substrate on the substrate table relative to the patterning structure. The alignment structure comprises a non-periodic feature which may be detectable as e.g. a capture position or a check position using a reference grating in the alignment subsystem. The non-periodic feature may cause a phase effect in the detected signal of the alignment subsystem or an amplitude effect.

Abstract: A method according to one embodiment of the invention may be performed using a calibration plate having at least one alignment marker and at least one height profile. First, the calibration plate is positioned using an alignment sensor. Then the height profile is measured by a height sensor. Then the calibration plate is rotated by substantially 180 degrees and the two operations are repeated. This procedure results in two measured height profiles, which are compared in order to find a best fit. The amount of shift performed to find the best fit is used to determine a distance between the alignment marker and the X,Y position of the measurement point of the height sensor.