Patents by Inventor Leon R. Barstad

Leon R. Barstad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolytic copper plating solutions
    Publication number: 20030010646
    Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
    Type: Application
    Filed: August 22, 2002
    Publication date: January 16, 2003
    Inventors: Leon R. Barstad, James E. Rychwalski, Mark Lefebvre, Stephane Menard, James L. Martin, Robert A. Schetty, Michael Toben
  • Electrolytic copper plating method
    Patent number: 6444110
    Abstract: The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
    Type: Grant
    Filed: May 17, 1999
    Date of Patent: September 3, 2002
    Assignee: Shipley Company, L.L.C.
    Inventors: Leon R. Barstad, James E. Rychwalski, Mark Lefebvre, Stephane Menard, James L. Martin, Robert A. Schetty, III, Michael Toben
  • Plating bath analysis
    Publication number: 20020074244
    Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
    Type: Application
    Filed: November 2, 2001
    Publication date: June 20, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
  • Seed layer repair method
    Publication number: 20020000382
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Application
    Filed: December 15, 2000
    Publication date: January 3, 2002
    Applicant: Shipley Company, L.L.C. of Marlborough
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann