Patents by Inventor Leon S. Greenberg

Leon S. Greenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plastic encapsulated semiconductor devices
    Patent number: 4124864
    Abstract: A plastic packaged semiconductor device having a heat sink includes a semiconductor device which requires ultrasonically bonded leads. External leads are attached to the heat sink and have end portions to which ultrasonic bonds can be made. The lead end portions are separated from the heat sink by a body of insulating material. Preferably, the insulating material is an epoxy adhesive which may contain reinforcing glass fibers.
    Type: Grant
    Filed: May 5, 1978
    Date of Patent: November 7, 1978
    Assignee: RCA Corporation
    Inventor: Leon S. Greenberg