Abstract: The present systems and methods relate to optimizing scheduling of appoints and or services via coordination between user calendars and service providers calendars. In some embodiments, opportunistic scheduling is performed when the systems and associated methods identify unsatisfied service needs on a user's calendar based on historic data, openings in the user's and service provider's calendars, and user and service provider location and/or time required to satisfy the appointments/service need.

Abstract: The bumper shield is a protective structure that mounts on a vehicle. The vehicle is further defined with a bumper and a trunk. The bumper is further defined with a superior surface. The bumper shield attaches to the superior surface of the bumper. The position of the bumper shield on the bumper is such that the bumper shield protects the bumper from impact damage caused by cargo hitting the bumper as the cargo is loaded and removed from the trunk. The bumper shield forms a sacrificial surface that separates the bumper and the cargo being loaded into the trunk. The bumper shield comprises a base strip and a parchment. The base strip attaches to the bumper. The parchment protects the base strip during storage of the bumper shield.

Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

Abstract: Disclosed herein are systems and methods for the thermal regulation of on-board electronic components using a mezzanine filler module. The mezzanine filler module connects at a mezzanine site of the circuit board to provide an additional thermal conduction path for thermal energy released, at least, from component located under the mezzanine site.

Abstract: A hay ring attachment device includes an enlongated vertically extending member having a top portion, a middle portion, and a lower portion, wherein an upper hay ring receiving assembly is fixedly secured to the top portion. A hay spear receiving assembly is adjustably positioned along the middle portion, and a lower hay ring receiving assembly is adjustably positioned along the lower portion. The hay ring attachment device enables an operator of the type of tractor commonly found on an agricultural farm to utilize a combination of both the three-point hydraulic hitch assembly and the hay spear of the type well known in the art to pick up, move, and lower a hay ring whether or not the hay ring is found to surround a hay bale when the pick-up process is initiated.