Abstract: A telephone distribution apparatus including a housing and a printed circuit board mounted within the housing. The apparatus is configured to enable mounting of the apparatus within small spaces. A first multi-position electrical plug is mounted on the circuit board and in electrical circuit relationship with a plurality of jacks also mounted on the board. The electrical plug and jacks are positioned within openings in the housing to provide a strong, easily assembled compact module for distributing telephone circuits from the multi-position plug to the plurality of jacks.