Patents by Inventor Leonard A. Merrill

Leonard A. Merrill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for dispersing heat from high-power electronic devices
    Patent number: 7457118
    Abstract: A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a heat dispersion device configured discretely from the heat absorbing device and the board for dispersing heat input thereto and a heat transporting device coupled between the heat absorption device and the heat dispersion device for transporting heat absorbed by the heat absorption device to the heat dispersion device.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: November 25, 2008
    Assignee: EMC Corporation
    Inventors: F. William French, Leonard A. Merrill
  • Electrical contact for a printed circuit board
    Patent number: 6179631
    Abstract: An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact.
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: January 30, 2001
    Assignee: EMC Corporation
    Inventors: Stuart D. Downes, Leonard A. Merrill
  • Electrical contact for printed circuit boards
    Patent number: 5589669
    Abstract: An electrical pin contact for mounting on a printed circuit board to provide an electrical interconnection to the printed circuit board. The contact includes an elongated, conductive pin, and a base attached to one end of the pin. The base has a triangular cross-section with vertices that engage a plate-through hole to support the contact in the plated-through hole during a soldering process. The contact may include a flange or stops to support the contact on a printed circuit board. The contact may also include a tail extending from the base opposite the pin.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: December 31, 1996
    Assignee: EMC Corporation
    Inventors: Stuart D. Downes, Leonard A. Merrill