Patents by Inventor Leonard A. Roland
Leonard A. Roland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8091225Abstract: The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.Type: GrantFiled: November 17, 2010Date of Patent: January 10, 2012Assignee: Tektronix, Inc.Inventors: Leonard A. Roland, Kathleen F. Ullom, Ira G. Pollock, James E. Spinar
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Publication number: 20110121849Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.Type: ApplicationFiled: November 17, 2010Publication date: May 26, 2011Applicant: Tektronix, Inc.Inventors: Leonard A. ROLAND, Kathleen F. ULLOM, Ira G. POLLOCK, James E. SPINAR
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Patent number: 7940067Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.Type: GrantFiled: September 8, 2008Date of Patent: May 10, 2011Assignee: Tektronix, Inc.Inventors: Leonard A. Roland, Kathleen F. Ullom, Ira G. Pollock, James E. Spinar
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Publication number: 20100060304Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.Type: ApplicationFiled: September 8, 2008Publication date: March 11, 2010Applicant: TEKTRONIX, INC.Inventors: Leonard A. ROLAND, Kathleen F. ULLOM, Ira G. POLLOCK, James E. SPINAR
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Patent number: 5207318Abstract: A switch is described that includes a plunger (20, FIG. 1 ) moveable between up and down position and having upper contacts (22, 24) and lower contacts (26, 28). When the plunger is moved to a down position, opposite ends of the upper contact (22) move down against first and second terminals (12, 14) to interconnect them. When the plunger is moved to an up position, opposite ends of the lower contact (26) move up against the first terminal (12) and a third terminal (16) to interconnect them. The plunger can move within a hole in a circuit board and carry two upper and two lower contacts to connect four terminals in two different ways. Each terminal can include upper and lower terminal pads (120, 122, FIG. 5 ) lying respectively on upper and lower surfaces of the circuit board and interconnected through plated-through holes (124) in the board.Type: GrantFiled: July 29, 1991Date of Patent: May 4, 1993Assignee: Dynatech Microwave Technology, Inc.Inventors: Leonard A. Roland, David T. Ko, Michael T. Long
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Patent number: 4831222Abstract: An integrated pad switch has conductive contacts that may be embedded in a flexible substrate to form a wiper contact. The flexible substrate is backed by a foamed elastic block and mounted on a driver. The wiper contact moves across the surface of a hybrid circuit substrate having an electrical circuit to provide the desired switching function.Type: GrantFiled: April 29, 1985Date of Patent: May 16, 1989Assignee: Tektronix, Inc.Inventors: Heinz E. Grellmann, Leonard A. Roland
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Patent number: 4695811Abstract: A high frequency coaxial switch has a coaxial connector mounted on a housing to provide electrical access to a cavity within the housing, the cavity being small to suppress moding. The coaxial connector is electrically connected to a microstrip conductor on a hybrid circuit board within the cavity, and switching is accomplished by compensated contact striplines which electrically make or break contact with the microstrip conductor.Type: GrantFiled: July 28, 1986Date of Patent: September 22, 1987Assignee: Tektronix, Inc.Inventors: Heinz E. Grellmann, Leonard A. Roland
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Patent number: 4686492Abstract: A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.Type: GrantFiled: March 4, 1985Date of Patent: August 11, 1987Assignee: Tektronix, Inc.Inventors: H. Erwin Grellmann, Leonard A. Roland
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Patent number: 4670723Abstract: A broad band, thin film attenuator for microwave circuits is constructed by placing a ground plane conductor on one side of a ceramic, insulating substrate, and conductive, resistive, and reactive elements on the other side of the substrate. Capacitive stubs are provided to compensate for inductance in grounding conductors between resistance elements and the ground plane conductor. Constrictions are provided in input and output conductors to provide increased series inductance to compensate for distributed capacitance of the resistance elements. One resistance element is constructed so that the interface between the input conductor and that resistance element forms an obtuse interior angle with an adjoining transitional edge extending from the input conductor to the grounding conductor, and the transitional edge forms an obtuse interior angle with the adjoining edge of the grounding conductor, so as to minimize current density concentrations and distributed capacitance.Type: GrantFiled: March 18, 1985Date of Patent: June 2, 1987Assignee: Tektronix, Inc.Inventors: Leonard A. Roland, Larry R. Lockwood, H. Erwin Grellmann
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Patent number: 4600907Abstract: An electrical connection between two semiconductor devices employs a coplanar microstrap waveguide comprising a plurality of thin straps of conductive metal embedded in a polyimide substrate and dimensioned to exhibit the properties of a coplanar waveguide. The waveguide structure provides the proper impedance matching between the two devices and enables them to handle signals having frequencies in the gigahertz range.Type: GrantFiled: March 7, 1985Date of Patent: July 15, 1986Assignee: Tektronix, Inc.Inventors: H. Erwin Grellman, Carl W. Laakso, John J. Reagan, Leonard A. Roland