Abstract: Assemblies and optical connectors including one or more optical fibers laser-bonded to a substrate, as well as methods for fabricating the same, are disclosed. In one embodiment, an assembly includes a substrate having a surface, an optical element bonded to the surface of the substrate, a bond area between the optical fiber and the surface of the substrate, wherein the bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate, and a metal buttress structure adjacent to the bond area.

Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Abstract: Assemblies having one or more optical fibers laser bonded to a substrate are disclosed. In one embodiment, an assembly includes a substrate having a surface, an array of optical elements bonded to the surface of the substrate, an epoxy disposed between individual optical elements of the array of optical elements, and a plurality of spacer elements disposed within the epoxy, wherein at least one spacer element of the plurality of spacer elements is positioned between adjacent optical elements of the array of optical elements, and the plurality of spacer elements has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the epoxy. The assembly includes a bond area between each optical element of the array of optical elements and the surface of the substrate, wherein the bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Abstract: A method of making a glass article, for example a glass light guide plate comprising at least one structured surface including a plurality of channels and peaks. The glass article may be suitable for enabling one dimensional dimming when used in a backlight unit for use as an illuminator for liquid crystal display devices.

Abstract: A laser-welded assembly of opposing sheets of ceramic and glass, ceramic, or glass-ceramic compositions comprises an intervening bonding layer having a thickness dimension that separates the opposing sheets by less than about 1000 nm. Each of the opposing sheets has a thickness dimension at least about 20 times the thickness dimension of the intervening bonding layer. The intervening bonding layer has a melting point greater than that of one or both of the opposing sheets. The ceramic sheet is a pass-through sheet with a composite T/R spectrum comprising a portion that lies below about 30% across a target irradiation band residing at or above about 1400 nm and at or below about 4500 nm wavelength. The intervening bonding layer has an absorption spectrum comprising a portion that lies above about 80% across the target irradiation band. The assembly comprises a weld bonding the opposing surfaces of the opposing sheets.

Abstract: The QD LED module (10) disclosed herein includes a support assembly (40), a circuit board (20), an LED (30) operably supported by the circuit board, wherein the LED emits blue light (36G). The QD LED module also has a QD structure (60) supported by the support assembly and axially spaced apart from the LED surface. The QD structure has an active area (AR) that includes a first region (R1) of QD material and a second region (R2) that has no QD material. A first portion of the blue light passes through the first region and is converted to red light (36R) and green light (36G). A second portion of the blue light passes through the second region. The QD material has a CIE color point that is shifted toward the yellow portion of the color space.

Abstract: A method of making a glass article, for example a glass light guide plate comprising at least one structured surface including a plurality of channels and peaks. The glass article may be suitable for enabling one dimensional dimming when used in a backlight unit for use as an illuminator for liquid crystal display devices.

Abstract: A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 ?m, and the inorganic particle layer has an average thickness of less than or equal to 5 ?m.

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((?tensile stress location)/(?interface laser weld))<<1 or <1 and ?interface laser weld>10 MPa or >1 MPa where ?tensile stress location is the stress present in the first substrate and ?interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((?tensile stress location)/(?interface laser weld))<<1 or <1 and ?interface laser weld>10 MPa or >1 MPa where ?tensile stress location is the stress present in the first substrate and ?interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.