Abstract: A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

Abstract: A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

Abstract: A method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

Abstract: Systems and methods for hysteretically controlling Light Emitting Diodes (LEDs) when the input voltage is greater than or equal to 18 volts. An example system includes one or more LEDs and a circuit electrically coupled to the one or more LEDs. The circuit hysteretically controls an input voltage supplied to the one or more LEDs based on a sensed electric current that passes through the LEDs. The circuit includes a MOSFET switch for switching on and off the input voltage supplied to the one or more LEDs, a current sensing subcircuit including a first integrated circuit (IC) for sensing the current flowing through the one or more LEDs, a hysteretic comparator circuit including a second IC for generating a hysteretic control signal based on the sensed current, and a switch driver including a third IC for controlling operation of the switch based on the generated hysteretic control signal.

Abstract: An LED current control device (100) includes an array of one or more LEDs (10) electrically connected to a current-sensing element (20). A sense signal produced by the current-sensing element may be amplified by a single-ended amplifier (30) and sent to a switching controller (40 and 50). The switching controller may perform hysteretic control on the amplified sense signal by controlling a switching element (60) to turn on and off. The on and off states of the switching element respectively enables and disables an external power supply (VEXT) for the LED array. As such, hysteretic control may be performed on the current flowing through the LEDs.

Abstract: A solid-state light emitting device strip lighting system. The system includes an elongated fixture, a reflector, and a strip including a plurality of solid-state light emitting devices electrically connected in series disposed along the fixture. A heat sink and/or the reflector is formed as an integral part of the elongated fixture. In one aspect of the invention, a beam angle of the plurality of light emitting devices perpendicular to the long axis of the elongated fixture is adjustable by varying the height of the strip containing the devices. In an additional aspect of the invention, at least one end cap is connected to the strip containing the devices in such a way that an external power converter and/or controller may be connected to the end cap to power and/or control the devices. These strip lights are daisy chainable in series, eliminating the need for multiple drops of AC supply wiring.

Abstract: An LED current control device (100) includes a set of one or more LEDs (10) connected to a current-sensing element (20) and an external voltage source (VEXT). A sense signal produced by the current-sensing element may be amplified by a sense signal amplifier (30) and sent to a switching controller (40 and 50). The switching controller may perform hysteretic control on the amplified sense signal by controlling a switching element 70 to turn on and off. The on and off states of the switching element respectively enables and disables power from the external voltage source to the LEDs. As such, hysteretic control may be performed on the current in the LEDs.

Abstract: A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

Abstract: A solid-state light emitting device strip lighting system. The system includes an elongated fixture, a reflector, and a strip including a plurality of solid-state light emitting devices electrically connected in series disposed along the fixture. A heat sink and/or the reflector is formed as an integral part of the elongated fixture. In one aspect of the invention, a beam angle of the plurality of light emitting devices perpendicular to the long axis of the elongated fixture is adjustable by varying the height of the strip containing the devices. In an additional aspect of the invention, at least one end cap is connected to the strip containing the devices in such a way that an external power converter and/or controller may be connected to the end cap to power and/or control the devices. These strip lights are daisy chainable in series, eliminating the need for multiple drops of AC supply wiring.

Abstract: Systems and methods for hysteretically controlling Light Emitting Diodes (LEDs) when the input voltage is greater than or equal to 18 volts. An example system includes one or more LEDs and a circuit electrically coupled to the one or more LEDs. The circuit hysteretically controls an input voltage supplied to the one or more LEDs based on a sensed electric current that passes through the LEDs. The circuit includes a MOSFET switch for switching on and off the input voltage supplied to the one or more LEDs, a current sensing subcircuit including a first integrated circuit (IC) for sensing the current flowing through the one or more LEDs, a hysteretic comparator circuit including a second IC for generating a hysteretic control signal based on the sensed current, and a switch driver including a third IC for controlling operation of the switch based on the generated hysteretic control signal.

Abstract: LED brightness compensation system and method to account for aging and/or temperature effects on LED brightness. The system includes one or more LEDs and a circuit coupled to the LEDs to maintain substantially constant LED brightness based on determined operating characteristics of the LEDs. The circuit includes an LED brightness controller for controlling the current running through the LEDs and a brightness compensation controller for directing the LED brightness controller to compensate for aging and/or temperature. The method includes: storing adjustment information in a memory unit; energizing one or more LEDs with an electric current; accumulating the operating time; sensing the operating temperature of the LEDs; and adjusting the current supplied to the LEDs based on the stored adjustment information, the accumulated time the LEDs have been energized, and the operating temperature of the LEDs.

Abstract: Systems and methods for hysteretically controlling Light Emitting Diodes (LEDs) in a high voltage environment. An example system includes a plurality of LEDs and a circuit electrically coupled to the plurality of LEDs. The circuit hysteretically controls an input voltage supplied to the plurality of LEDs based on an input voltage and a pulse width modulation signal, when the input voltage is greater than 18 volts. The circuit includes an N-Channel or P-Channel MOSFET switch for switching on and off the input voltage supplied to the plurality of LEDs, a hysteretic controller for generating a hysteretic control signal, and a subcircuit for controlling operation of the MOSFET switch based on the generated hysteretic control signal. The subcircuit maintains an acceptable voltage differential between a gate and a source of the MOSFET switch based on the generated hysteretic control signal and the input voltage.

Abstract: An LED current control device (100) includes an array of one or more LEDs (10) electrically connected to a current-sensing element (20). A sense signal produced by the current-sensing element may be amplified by a single-ended amplifier (30) and sent to a switching controller (40 and 50). The switching controller may perform hysteretic control on the amplified sense signal by controlling a switching element (60) to turn on and off. The on and off states of the switching element respectively enables and disables an external power supply (VEXT) for the LED array. As such, hysteretic control may be performed on the current flowing through the LEDs.

Abstract: An LED current control device (100) includes a set of one or more LEDs (10) connected to a current-sensing element (20) and an external voltage source (VEXT). A sense signal produced by the current-sensing element may be amplified by a sense signal amplifier (30) and sent to a switching controller (40 and 50). The switching controller may perform hysteretic control on the amplified sense signal by controlling a switching element 70 to turn on and off. The on and off states of the switching element respectively enables and disables power from the external voltage source to the LEDs. As such, hysteretic control may be performed on the current in the LEDs.