Abstract: This invention relates to phenolic resin compositions containing less than 5 percent by weight of wholly inorganic expansible clay particles well dispersed therein, methods for making the same, and articles incorporating the same. The wholly inorganic clay particles are added to a phenolic resin liquid, where the clay form as added can range between a powder and a dilute aqueous dispersion. The resulting phenolic resin and clay compositions have improved physical properties and increased adhesion to other materials.