Patents by Inventor Leonard Eugene Fennell
Leonard Eugene Fennell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11710678Abstract: A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.Type: GrantFiled: March 29, 2019Date of Patent: July 25, 2023Assignee: Frore Systems Inc.Inventors: Suryaprakash Ganti, Seshagiri Rao Madhavapeddy, Leonard Eugene Fennell, Vikram Mukundan
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Publication number: 20230177863Abstract: Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.Type: ApplicationFiled: January 30, 2023Publication date: June 8, 2023Inventors: Hrishikesh Vijaykumar Panchawagh, IIa Ravindra Badge, Yipeng LU, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, Chin-Jen Tseng, Nicholas Ian Buchan, Tsongming Kao, Leonard Eugene Fennell, Firas Sammoura, Jessica Liu Strohmann, David William Burns
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Publication number: 20220087064Abstract: A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.Type: ApplicationFiled: September 7, 2021Publication date: March 17, 2022Inventors: Suryaprakash Ganti, Brian James Gally, Ming-Hau Tung, Seshagiri Rao Madhavapeddy, Vikram Mukundan, Ananth Saran Yalamarthy, Leonard Eugene Fennell
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Patent number: 11063203Abstract: Disclosed are methods, devices, apparatuses, and systems for poling a piezoelectric film. A poling system can be a corona poling system including a corona source with one or more corona wires configured to transfer a corona discharge onto a major surface of the piezoelectric film. The poling system can further include a grid electrode interposed between the corona source and the piezoelectric film. A substrate including the piezoelectric film may be supported on a substrate support, where the substrate and the corona source are configured to move relative to each other during poling.Type: GrantFiled: December 11, 2017Date of Patent: July 13, 2021Assignee: QUALCOMM IncorporatedInventors: Fan Zhong, Jack Conway Kitchens, II, Leonard Eugene Fennell, Nicholas Ian Buchan
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Publication number: 20210193900Abstract: A method for providing a piezoelectric device is described. The method includes providing a first electrode layer on a substrate and coating at least one layer of piezoelectric material. The coating using at least one of clot-die coating, dip coating, aerosol coating and R2R coating such that a layer of the at least one layer of piezoelectric material has a variation in thickness of not more than ten percent. The layer(s) of piezoelectric materials are also heat treated. Multiple layers of piezoelectric material may be slot-die coated and heat treated to provide a multilayer having the desired thickness. A second electrode layer is provided on the layer(s) of piezoelectric material.Type: ApplicationFiled: December 20, 2019Publication date: June 24, 2021Inventors: Suryaprakash Ganti, Leonard Eugene Fennell, Ming Tung, Brian James Gally
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Patent number: 11003884Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.Type: GrantFiled: February 10, 2017Date of Patent: May 11, 2021Assignee: QUALCOMM IncorporatedInventors: Nicholas Ian Buchan, Mario Francisco Velez, Chin-Jen Tseng, Hrishikesh Vijaykumar Panchawagh, Firas Sammoura, Jessica Liu Strohmann, Kostadin Dimitrov Djordjev, David William Burns, Leonard Eugene Fennell, Jon Gregory Aday
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Publication number: 20200049387Abstract: A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.Type: ApplicationFiled: March 29, 2019Publication date: February 13, 2020Inventors: Suryaprakash Ganti, Seshagiri Rao Madhavapeddy, Leonard Eugene Fennell, Vikram Mukundan
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Publication number: 20180373913Abstract: Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.Type: ApplicationFiled: June 12, 2018Publication date: December 27, 2018Inventors: Hrishikesh Vijaykumar Panchawagh, Ila Ravindra Badge, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, Chin-Jen Tseng, Nicholas Ian Buchan, Tsongming Kao, Leonard Eugene Fennell, Firas Sammoura, Jessica Liu Strohmann, David William Burns
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Patent number: 10036734Abstract: This disclosure provides systems, methods and apparatus related to an ultrasonic sensor for detecting ultrasonic energy. In some implementations, the ultrasonic sensor includes a piezoelectric receiver layer bonded with an adhesive to an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit. Methods of forming ultrasonic sensors include bonding piezoelectric receiver layers to TFT arrays.Type: GrantFiled: June 2, 2014Date of Patent: July 31, 2018Assignee: SNAPTRACK, Inc.Inventors: Leonard Eugene Fennell, Nicholas Ian Buchan, David William Burns, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, Jack Conway Kitchens, II, John Keith Schneider, Nathaniel Robert Bennett, Kristopher Andrew Lavery
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Publication number: 20180198055Abstract: Disclosed are methods, devices, apparatuses, and systems for poling a piezoelectric film. A poling system can be a corona poling system including a corona source with one or more corona wires configured to transfer a corona discharge onto a major surface of the piezoelectric film. The poling system can further include a grid electrode interposed between the corona source and the piezoelectric film. A substrate including the piezoelectric film may be supported on a substrate support, where the substrate and the corona source are configured to move relative to each other during poling.Type: ApplicationFiled: December 11, 2017Publication date: July 12, 2018Inventors: Fan Zhong, Jack Conway Kitchens, II, Leonard Eugene Fennell, Nicholas Ian Buchan
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Patent number: 9945818Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.Type: GrantFiled: February 20, 2015Date of Patent: April 17, 2018Assignee: QUALCOMM IncorporatedInventors: Suryaprakash Ganti, Srikanth Chilukuru, Livingstone Song, Kostadin Dimitrov Djordjev, Jack Conway Kitchens, John Schneider, Nicholas Ian Buchan, Leonard Eugene Fennell, Hrishikesh Vijaykumar Panchawagh, Ashish Hinger, Nai-Kuei Kuo, Kollengode Narayanan, Samir Kumar Gupta, Timothy Dickinson, Max Hamel, David William Burns, Muhammed Ibrahim Sezan, Eugene Dantsker
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Publication number: 20170364726Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.Type: ApplicationFiled: February 10, 2017Publication date: December 21, 2017Inventors: Nicholas Ian Buchan, Mario Francisco Velez, Chin-Jen Tseng, Hrishikesh Vijaykumar Panchawagh, Firas Sammoura, Jessica Liu Strohmann, Kostadin Dimitrov Djordjev, David Williams Burns, Leonard Eugene Fennell, Jon Gregory Aday
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Patent number: 9323393Abstract: Various techniques and apparatuses are disclosed that provide for pixelated display modules that integrate an ultrasonic fingerprint or biometric sensing capability. In some implementations, the ultrasonic fingerprint sensor and the display components of the display module may share a common backplane. In some implementations, the ultrasonic fingerprint sensor may share a flex cable with other components in the display module. In some implementations, the ultrasonic fingerprint sensor may leverage conductive traces on a cover glass used to provide for touch input to the display module.Type: GrantFiled: November 4, 2013Date of Patent: April 26, 2016Assignee: QUALCOMM IncorporatedInventors: Kostadin Dimitrov Djordjev, Leonard Eugene Fennell, Nicholas Ian Buchan, David William Burns, Samir K. Gupta, Sanghoon Bae
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Publication number: 20150241393Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.Type: ApplicationFiled: February 20, 2015Publication date: August 27, 2015Inventors: Suryaprakash Ganti, Srikanth Chilukuru, Livingstone Song, Kostadin Dimitrov Djordjev, Jack Conway Kitchens, John Schneider, Nicholas Ian Buchan, Leonard Eugene Fennell, Hrishikesh Vijaykumar Panchawagh, Ashish Hinger, Nai-Kuei Kuo, Kollengode Narayanan, Samir Kumar Gupta, Timothy Dickinson, Max Hamel, David William Burns, Muhammed Ibrahim Sezan, Eugene Dantsker
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Publication number: 20140354596Abstract: Various techniques and apparatuses are disclosed that provide for pixelated display modules that integrate an ultrasonic fingerprint or biometric sensing capability. In some implementations, the ultrasonic fingerprint sensor and the display components of the display module may share a common backplane. In some implementations, the ultrasonic fingerprint sensor may share a flex cable with other components in the display module. In some implementations, the ultrasonic fingerprint sensor may leverage conductive traces on a cover glass used to provide for touch input to the display module.Type: ApplicationFiled: November 4, 2013Publication date: December 4, 2014Applicant: QUALCOMM IncorporatedInventors: Kostadin Dimitrov Djordjev, Leonard Eugene Fennell, Nicholas Ian Buchan, David William Burns, Samir K. Gupta, Sanghoon Bae
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Publication number: 20140352440Abstract: This disclosure provides systems, methods and apparatus related to an ultrasonic sensor for detecting ultrasonic energy. In some implementations, the ultrasonic sensor includes a piezoelectric receiver layer bonded with an adhesive to an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit. Methods of forming ultrasonic sensors include bonding piezoelectric receiver layers to TFT arrays.Type: ApplicationFiled: June 2, 2014Publication date: December 4, 2014Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Leonard Eugene Fennell, Nicholas Ian Buchan, David William Burns, Kostadin Dimitrov Djordjev, Stephen Michael Gojevic, Jack Conway Kitchens, II, John Keith Schneider, Nathaniel Robert Bennett, Kristopher Andrew Lavery
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Publication number: 20140029078Abstract: This disclosure provides systems, methods and apparatus for protecting electromechanical systems (EMS) devices from mechanical interference. In one aspect, an array of EMS devices may include one or more regions in which an EMS device is replaced with a spacer structure, such that the overall height of the spacer structure is greater than the height of the surrounding EMS devices. In another aspect, resilient spacer structures can be formed overlying stable portions of an EMS device array. These resilient spacer structures may be formed from a cross-linked organic material.Type: ApplicationFiled: July 24, 2012Publication date: January 30, 2014Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Leonard Eugene Fennell, Tsongming Kao, Teruo Sasagawa, Sapna Patel, Hung-Jen Wang
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Publication number: 20130129922Abstract: This disclosure provides systems, methods and apparatus for processing multiple substrates in a batch cluster tool. A batch cluster tool can include a transfer chamber, an etch process chamber, and one or both of an ALD process chamber and an SAM process chamber. Multiple substrates are transferred from a transfer chamber into an etch chamber. The substrates are exposed to a vapor phase etchant. The substrates can then transferred to an atomic layer deposition (ALD) chamber and exposed to vapor phase reactants to form a thin film on the substrates by ALD. The substrates can be transferred either from the etch process chamber or the ALD chamber to a third chamber and exposed to vapor phase reactants to form a self-assembled monolayer (SAM) on the substrates.Type: ApplicationFiled: November 21, 2011Publication date: May 23, 2013Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Teruo Sasagawa, Leonard Eugene Fennell
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Publication number: 20130049844Abstract: This disclosure provides systems, methods, and apparatus related to a capacitive touch sensor with light shielding structures. In one aspect, a device includes an array formed by a plurality of row electrodes and a plurality of non-transparent column electrodes, wherein at least a first portion of the row electrodes is non-transparent and coplanar with the column electrodes and at least a second portion of the row electrodes is non-coplanar with the column electrodes. The device further includes light shielding structures that are non-transparent and coplanar with the column electrodes, wherein the light shielding structures substantially overlap the second portion.Type: ApplicationFiled: August 23, 2011Publication date: February 28, 2013Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Ion Bita, Leonard Eugene Fennell, William J. Cummings
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Publication number: 20120105385Abstract: This disclosure provides systems, methods, and apparatus for producing roughness in an electromechanical device by nucleation under plasma CVD conditions. In one aspect, a substrate and at least a first layer are provided. The disclosure further provides gas phase nucleating particles under plasma CVD conditions and depositing a first layer, where the particles are incorporated into the first layer to create roughness in the first layer. The roughness may be transferred to a second layer by conformal deposition of the second layer over the first layer. The roughness of the second layer corresponds to the roughness of the first layer, where the first layer has a roughness greater than or equal to about 20 ? root mean square (RMS).Type: ApplicationFiled: November 2, 2010Publication date: May 3, 2012Applicant: QUALCOMM MEMS Technologies, Inc.Inventors: Teruo Sasagawa, Leonard Eugene Fennell