Patents by Inventor Leonard Interrante

Leonard Interrante has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060099819
    Abstract: Low dielectric compositions and methods of use thereof in integrated circuits are disclosed. The low dielectric compositions are derived from carbosilane polymers and oligomers containing imbedded sila- or disilacyclobutane rings and, after heating to induce cross-linking, may be used as an interlayer dielectric as well as a capping layer within an integrated circuit.
    Type: Application
    Filed: September 2, 2005
    Publication date: May 11, 2006
    Applicant: Rensselaer Polytechnic Institute
    Inventors: Leonard Interrante, Zhizhong Wu, Pei-I Wang, Toh-Ming Lu