Abstract: An automated vision system for identifying patterns, such as the solder bump patterns or leads of electronic components. The system is capable of correctly identifying the deviations of an imaged pattern from the nominal location of a reference pattern even if the imaged features are displaced more than half the minimum distance between any two adjacent features of the reference pattern. Further, the system is not limited to identifying patterns that have been merely translated relative to the reference pattern, but can be used if the imaged pattern has been rotated more than 45.degree. relative to the reference pattern depending on the symmetry of the pattern.

Abstract: An integrated circuit module to printed circuit board interconnection system wherein the board has circuit pads to which spring contacts have one of their ends soldered to the pads. The module has circuit pads on one surface thereof and a pivotal connection is provided for loading the module onto the circuit board whereby the opposite ends of the spring contacts engage the circuit pads on the module with a wiping action and are retained in engagement therewith.