Patents by Inventor Leonard J. Pollock

Leonard J. Pollock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder bearing lead
    Patent number: 5688150
    Abstract: A solder-bearing metallic lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a substrate or other conductive pad.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: November 18, 1997
    Assignee: North American Specialties Corporation
    Inventors: Jack Seidler, Leonard J. Pollock