Patents by Inventor Leonard Mora

Leonard Mora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bond integrated circuit package for high speed I/O
    Patent number: 7804167
    Abstract: An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: September 28, 2010
    Assignee: LSI Logic Corporation
    Inventors: Clifford Fishley, Abiola Awujoola, Leonard Mora, Amar Amin, Maurice Othieno, Chok J. Chia
  • WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O
    Publication number: 20080128919
    Abstract: An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Inventors: Clifford Fishley, Abiola Awujoola, Leonard Mora, Amar Amin, Maurice Othieno, Chok J. Chia