Abstract: Disclosed is a compensating roll pin securing a heat sink to a circuit board. The roll pin comprises a deformable body of resilient material, such as annealed spring steel, formed into a generally cylindrical body having first and second end portions separated by a middle portion of enlarged external diameter and an axially extending gap in the surface of the body. A method of use is also disclosed wherein the first end portion of the roll pin is inserted into an aperture in a heat sink and the middle portion deformed within the aperture to form a tight fit between the pin and heat sink. A substantial part of the middle portion remains outside the aperture in the heat sink. The second end portion is inserted into a hole in a circuit board and forms an interference fit therewith. The middle portion forms a stop to prevent further insertion of the roll pin into the circuit board so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Abstract: Disclosed is a compensating roll pin securing a heat sink to a circuit board. The roll pin comprises a deformable body of resilient material, such as annealed spring steel, formed into a generally cylindrical body having first and second end portions separated by a middle portion of enlarged external diameter and an axially extending gap in the surface of the body. A method of use is also disclosed wherein the first end portion of the roll pin is inserted into an aperture in a heat sink and the middle portion deformed within the aperture to form a tight fit between the pin and heat sink. A substantial part of the middle portion remains outside the aperture in the heat sink. The second end portion is inserted into a hole in a circuit board and forms an interference fit therewith. The middle portion forms a stop to prevent further insertion of the roll pin into the circuit board so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Abstract: A compensating roll pin (10) is disclosed for use in securing a heat sink (12) to a circuit board (14). The roll pin (10) is formed by rolling a deformable material, such as annealed spring steel, into a generally cylindrical shape. The pin (10) has first and second end portions (22, 26) separated by a middle portion (24) of increased external diameter. The first end portion (22) can be inserted in the aperture (34) in the heat sink (12) and the middle portion (24) can be deformed within the aperture (34) to form a tight fit between the pin and heat sink. A substantial part of the middle portion (24) remains outside the aperture (34) in the heat sink. The second end portion (26) can be slidably inserted within the hole (38) in the circuit board (14) for an interference fit therebetween. The middle portion (24) forms a stop to prevent further insertion of the roll pin (10) within the circuit board (14) so that a gap of predetermined distance separates the heat sink and circuit board to enhance cooling.

Abstract: Disclosed is a solderable stake for attaching a heat sink to a mounting board such as a circuit board or the like. The stake is a unitary body having a shank supporting a transverse base with parallel spaced apart fingers extending from the base cooperating with the base to define a channel. The stake body is tin-plated. The edge of the heat sink is inserted into the channel between the fingers and retained therein by the spring-clip action of the fingers. The assembly may be attached to the circuit board by conventional soldering simultaneously with soldering of other component leads and the like.