Patents by Inventor Leonard TEDESCHI
Leonard TEDESCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230343568Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.Type: ApplicationFiled: November 29, 2022Publication date: October 26, 2023Inventors: Yaoling Pan, Patrick John Tae, Michael D. Willwerth, Leonard Tedeschi, Kiyki-Shiy N. Shang, Mikhail V. Taraboukhine, Charles R. Hardy, Sivasankar Nagarajan
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Patent number: 11735486Abstract: Embodiments include process monitoring devices and methods of using such process monitoring devices. In one embodiment, the process monitoring device includes a substrate. The process monitoring device may also include a plurality of sensors formed on a support surface of the substrate. According to an embodiment, each sensor is capable of producing an output signal that corresponds to a processing condition. Furthermore, embodiments include a process monitoring device that includes a network interface device that is formed on the substrate. According to an embodiment each of the plurality of sensors is communicatively coupled to the network interface device. The network interface device allows for the output signals obtained from the sensors to be wirelessly transmitted to an external computer during processing operations.Type: GrantFiled: September 18, 2020Date of Patent: August 22, 2023Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Kartik Ramaswamy
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Publication number: 20230103165Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.Type: ApplicationFiled: November 29, 2022Publication date: March 30, 2023Inventors: Yaoling Pan, Patrick John Tae, Michael D. Willwerth, Leonard Tedeschi, Kiyki-Shiy N. Shang, Mikhail V. Taraboukhine, Charles R. Hardy, Sivasankar Nagarajan
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Patent number: 11581206Abstract: Embodiments disclosed herein comprise a sensor. In an embodiment, the sensor comprises a substrate having a first surface and a second surface opposite from the first surface. In an embodiment, the sensor further comprises a first electrode over the first surface of the substrate, and a second electrode over the first surface of the substrate and adjacent to the first electrode. In an embodiment, the sensor further comprises a barrier layer over the first electrode and the second electrode.Type: GrantFiled: March 6, 2020Date of Patent: February 14, 2023Assignee: Applied Materials, Inc.Inventors: Yaoling Pan, Patrick John Tae, Leonard Tedeschi, Jennifer Sun, Philip Allan Kraus, Xiaopu Li, Kallol Bera, Michael D. Willwerth, Albert Barrett Hicks, III, Lisa J. Enman, Mark Joseph Saly, Daniel Thomas McCormick
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Patent number: 11551905Abstract: Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.Type: GrantFiled: March 19, 2018Date of Patent: January 10, 2023Assignee: Intel CorporationInventors: Yaoling Pan, Vijaykumar Krithivasan, Shimin Mao, Kelvin Chan, Michael D. Willwerth, Anantha Subramani, Ashish Goel, Chih-shun Lu, Philip Allan Kraus, Patrick John Tae, Leonard Tedeschi
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Patent number: 11545346Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.Type: GrantFiled: March 6, 2020Date of Patent: January 3, 2023Assignee: Applied Materials, Inc.Inventors: Yaoling Pan, Patrick John Tae, Michael D. Willwerth, Leonard Tedeschi, Kiyki-Shiy N. Shang, Mikhail V. Taraboukhine, Charles R. Hardy, Sivasankar Nagarajan
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Publication number: 20220341867Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.Type: ApplicationFiled: July 8, 2022Publication date: October 27, 2022Inventors: YAOLING PAN, PATRICK JOHN TAE, LEONARD TEDESCHI, MICHAEL D. WILLWERTH, DANIEL THOMAS MCCORMICK
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Patent number: 11415538Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.Type: GrantFiled: March 6, 2020Date of Patent: August 16, 2022Assignee: Applied Materials, Inc.Inventors: Yaoling Pan, Patrick John Tae, Leonard Tedeschi, Michael D. Willwerth, Daniel Thomas McCormick
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Patent number: 11348846Abstract: Embodiments include devices and methods for detecting material deposition and material removal performed by a wafer processing tool. In an embodiment, one or more micro sensors mounted on a process chamber of the wafer processing tool are capable of operating under vacuum conditions and/or may measure material deposition and removal rates in real-time during a plasma-less wafer fabrication process. Other embodiments are also described and claimed.Type: GrantFiled: September 18, 2020Date of Patent: May 31, 2022Assignee: Applied Materials, Inc.Inventor: Leonard Tedeschi
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Publication number: 20210280399Abstract: Capacitive sensors and capacitive sensing locations for plasma chamber condition monitoring are described. In an example, a plasma processing chamber includes a chamber wall surrounding a processing region. A chamber lid is over the chamber wall and above the processing region. A chamber floor is beneath the chamber wall and below the processing region. A support pedestal is in the processing region and below the chamber lid and above the chamber floor, and the support pedestal surrounded by the chamber wall. A capacitive sensor module can be in an opening of the chamber wall. The chamber lid can include a capacitive sensor module. The chamber floor can include an evacuation port and a capacitive sensor module within or adjacent to the evacuation port. The support pedestal can include a ring structure surrounding a substrate support region, and a capacitive sensor module in an opening of the ring structure.Type: ApplicationFiled: March 6, 2020Publication date: September 9, 2021Inventors: Yaoling Pan, Patrick John Tae, Leonard Tedeschi, Philip Allan Kraus, Michael D. Willwerth
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Publication number: 20210280443Abstract: Embodiments disclosed herein comprise a sensor. In an embodiment, the sensor comprises a substrate having a first surface and a second surface opposite from the first surface. In an embodiment, the sensor further comprises a first electrode over the first surface of the substrate, and a second electrode over the first surface of the substrate and adjacent to the first electrode. In an embodiment, the sensor further comprises a barrier layer over the first electrode and the second electrode.Type: ApplicationFiled: March 6, 2020Publication date: September 9, 2021Inventors: Yaoling Pan, Patrick John Tae, Leonard Tedeschi, Jennifer Sun, Philip Allan Kraus, Xiaopu Li, Kallol Bera, Michael D. Willwerth, Albert Barrett Hicks, III, Lisa J. Enman, Mark Joseph Saly, Daniel Thomas McCormick
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Publication number: 20210280400Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.Type: ApplicationFiled: March 6, 2020Publication date: September 9, 2021Inventors: Yaoling Pan, Patrick John Tae, Michael D. Willwerth, Leonard Tedeschi, Kiyki-Shiy N. Shang, Mikhail V. Taraboukhine, Charles R. Hardy, Sivasankar Nagarajan
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Publication number: 20210278360Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.Type: ApplicationFiled: March 6, 2020Publication date: September 9, 2021Inventors: Yaoling Pan, Patrick John Tae, Leonard Tedeschi, Michael D. Willwerth, Daniel Thomas McCormick
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Patent number: 11088000Abstract: Embodiments may also include a residual chemical reaction diagnostic device. The residual chemical reaction diagnostic device may include a substrate and a residual chemical reaction sensor formed on the substrate. In an embodiment, the residual chemical reaction sensor provides electrical outputs in response to the presence of residual chemical reactions. In an embodiment, the substrate is a device substrate, and the sensor is formed in a scribe line of the device substrate. In an alternative embodiment, the substrate is a process development substrate. In some embodiments, the residual chemical reaction sensor includes, a first probe pad, wherein a plurality of first arms extend out from the first probe pad, and a second probe pad, wherein a plurality of second arms extend out from the second probe pad and are interdigitated with the first arms.Type: GrantFiled: December 10, 2019Date of Patent: August 10, 2021Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Benjamin Schwarz, Changhun Lee, Ping Han Hsieh, Adauto Diaz, Jr., Daniel T. McCormick
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Patent number: 10923405Abstract: Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a particle monitoring device for particle detection includes several capacitive micro sensors mounted on a wafer substrate to detect particles under all pressure regimes, e.g., under vacuum conditions. In an embodiment, one or more capacitive micro sensors is mounted on a wafer processing tool to measure material deposition and removal rates in real-time during the wafer fabrication process. Other embodiments are also described and claimed.Type: GrantFiled: August 29, 2018Date of Patent: February 16, 2021Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Kartik Ramaswamy, Daniel Thomas McCormick, Robert Paul Meagley
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Publication number: 20210005518Abstract: Embodiments include process monitoring devices and methods of using such process monitoring devices. In one embodiment, the process monitoring device includes a substrate. The process monitoring device may also include a plurality of sensors formed on a support surface of the substrate. According to an embodiment, each sensor is capable of producing an output signal that corresponds to a processing condition. Furthermore, embodiments include a process monitoring device that includes a network interface device that is formed on the substrate. According to an embodiment each of the plurality of sensors is communicatively coupled to the network interface device. The network interface device allows for the output signals obtained from the sensors to be wirelessly transmitted to an external computer during processing operations.Type: ApplicationFiled: September 18, 2020Publication date: January 7, 2021Inventors: Leonard Tedeschi, Kartik Ramaswamy
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Publication number: 20210005521Abstract: Embodiments include devices and methods for detecting material deposition and material removal performed by a wafer processing tool. In an embodiment, one or more micro sensors mounted on a process chamber of the wafer processing tool are capable of operating under vacuum conditions and/or may measure material deposition and removal rates in real-time during a plasma-less wafer fabrication process. Other embodiments are also described and claimed.Type: ApplicationFiled: September 18, 2020Publication date: January 7, 2021Inventor: Leonard Tedeschi
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Patent number: 10818564Abstract: Embodiments include devices and methods for detecting material deposition and material removal performed by a wafer processing tool. In an embodiment, one or more micro sensors mounted on a process chamber of the wafer processing tool are capable of operating under vacuum conditions and/or may measure material deposition and removal rates in real-time during a plasma-less wafer fabrication process. Other embodiments are also described and claimed.Type: GrantFiled: March 11, 2016Date of Patent: October 27, 2020Assignee: Applied Materials, Inc.Inventor: Leonard Tedeschi
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Patent number: 10818561Abstract: Embodiments include process monitoring devices and methods of using such process monitoring devices. In one embodiment, the process monitoring device includes a substrate. The process monitoring device may also include a plurality of sensors formed on a support surface of the substrate. According to an embodiment, each sensor is capable of producing an output signal that corresponds to a processing condition. Furthermore, embodiments include a process monitoring device that includes a network interface device that is formed on the substrate. According to an embodiment each of the plurality of sensors is communicatively coupled to the network interface device. The network interface device allows for the output signals obtained from the sensors to be wirelessly transmitted to an external computer during processing operations.Type: GrantFiled: January 28, 2016Date of Patent: October 27, 2020Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Kartik Ramaswamy
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Patent number: 10718719Abstract: Embodiments include devices and methods for detecting particles in a wafer processing tool. In an embodiment, a particle monitoring device having a wafer form factor includes several micro sensors capable of operating in all pressure regimes, e.g., under vacuum conditions. The particle monitoring device may include a clock to output a time value when a parameter of a micro sensor changes in response to receiving a particle within a chamber of the wafer processing tool. A location of the micro sensor or the time value may be used to determine a source of the particle. Other embodiments are also described and claimed.Type: GrantFiled: July 31, 2018Date of Patent: July 21, 2020Assignee: Applied Materials, Inc.Inventors: Leonard Tedeschi, Kartik Ramaswamy