Abstract: A track driven work machine including a body, a first track laying assembly pivotally connected to the body, and a second track laying assembly pivotally connected to the body. The second track laying assembly is spaced apart from the first track laying assembly in a direction transverse to a running direction of the track laying assemblies. In order to navigate uneven grounds, the track driven work machine includes a hydraulic system for synchronizing pivotal movement of the first and second track laying assembly and which is configured to pivot the second track laying assembly in an opposite direction to the first track laying assembly when the first track laying assembly is pivoted in a first direction, and vice versa.

Abstract: A track driven work machine including a body, a first track laying assembly pivotally connected to the body, and a second track laying assembly pivotally connected to the body. The second track laying assembly is spaced apart from the first track laying assembly in a direction transverse to a running direction of the track laying assemblies. In order to navigate uneven grounds, the track driven work machine includes a hydraulic system for synchronizing pivotal movement of the first and second track laying assembly and which is configured to pivot the second track laying assembly in an opposite direction to the first track laying assembly when the first track laying assembly is pivoted in a first direction, and vice versa.

Abstract: A thermal transfer plate (TTP) includes a thermally conductive plate, at least one footpad and at least one reference protrusion. The footpad includes a spring zone and a standoff member. In an implementation, the reference protrusion contacts a top surface of a substrate. In another implementation, the reference protrusion contacts a top surface of an integrated circuit. Both implementations permit the thickness of the gap between the integrated circuit and the TTP to be optimized for efficient transfer of heat from an integrated circuit.

Abstract: A thermal transfer plate (TTP) includes a thermally conductive plate, at least one footpad and at least one reference protrusion. The footpad includes a spring zone and a standoff member. In an implementation, the reference protrusion contacts a top surface of a substrate. In another implementation, the reference protrusion contacts a top surface of an integrated circuit. Both implementations permit the thickness of the gap between the integrated circuit and the TTP to be optimized for efficient transfer of heat from an integrated circuit.

Abstract: A thermal transfer plate (TTP) includes a thermally conductive plate, at least one footpad and at least one reference protrusion. The footpad includes a spring zone and a standoff member. In an implementation, the reference protrusion contacts a top surface of a substrate. In another implementation, the reference protrusion contacts a top surface of an integrated circuit. Both implementations permit the thickness of the gap between the integrated circuit and the TTP to be optimized for efficient transfer of heat from an integrated circuit.

Abstract: A shredder for brushwood and the like (FIG. 1) has at least one shaft carrying a helically arranged array of cutting discs surrounding the shaft. The discs are individually fixed on lugs which are generally radial to the shaft. As the brushwood is fed along generally parallel to the shaft axis it is impacted by the cutter discs, acting against one another where two parallel shafts are employed, or between the discs and a surrounding chamber wall if only a single shaft is employed. The shredded material is further fed and exhausted through a delivery passage by a current of air induced both by the discs and also by fan vanes carried by the shaft. The advantage of the discs as cutters is that if and when worn or blunted, each can be adjusted angularly on its lug to present a fresh portion of its periphery for action, without it being necessary to immediately replace or re-sharpen it.

Abstract: An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention comprises a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit comprises a lead frame which is attached to a metal body.

Abstract: An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention includes a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit features a lead frame which is attached to a metal body.