Patents by Inventor Leonard Vasiliev

Leonard Vasiliev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030141045
    Abstract: Disclosed is a heat pipe comprising: an evaporating section, a heat insulating section, a condensing section and a porous sintered powder wick structure, in which the wick structure comprises sub-structures different from one another in at least one selected from group including material, shape and particle size, each of the sub-structures being arranged into each of the evaporating, heat insulating and condensing sections, in which the wick structure has a biporous distribution made through sintering of a powder mixture having various particle sizes to increase porosity and permeability of the wick structure, and in which the heat pipe has an asymmetric cross sectional shape in a radial direction. Powder having a large particle size is readily inserted into the heat pipe to simplify manufacture of the heat pipe while thermal conductivity of the heat pipe is not degraded compared to a conventional structure which is not eccentric.
    Type: Application
    Filed: June 5, 2002
    Publication date: July 31, 2003
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Min Oh, Leonard Vasiliev