Patents by Inventor Leonardo S. Rimpillo

Leonardo S. Rimpillo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Deformation-absorbing leadframe for semiconductor devices
    Publication number: 20020190358
    Abstract: A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; and each said support member having at least one portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member.
    Type: Application
    Filed: August 6, 2002
    Publication date: December 19, 2002
    Inventors: Ronaldo M. Arguelles, Reynante T. Alvarado, Leonardo S. Rimpillo, Teddy D. Weygan
  • Deformation-absorbing leadframe for semiconductor devices
    Patent number: 6455922
    Abstract: A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; and each said support member having at least one portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member.
    Type: Grant
    Filed: June 21, 2000
    Date of Patent: September 24, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Ronaldo M. Arguelles, Reynante T. Alvarado, Leonardo S. Rimpillo, Jr., Teddy D. Weygan