Patents by Inventor Leonardus A. E. Van Gemert

Leonardus A. E. Van Gemert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package, method of manufacturing a package and frame
    Patent number: 8217281
    Abstract: The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame contact pads outside the die attach area with connecting elements. The chip, the connecting elements and the frame contact pads outside the die attach area are anchored in an electrically insulating encapsulation. The frame contact pads each comprise a first patterned layer and a second patterned layer, which second layer has the surface that is exposed outside the encapsulation. At least a portion of the frame contact pads in the die attach area has a first patterned layer with a first pattern that comprises at least one flange/lead that is outside the second patterned layer when seen in perpendicular projection of the first layer on the second layer.
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: July 10, 2012
    Assignee: NXP B.V.
    Inventors: Leonardus A. E. Van Gemert, Marcus F. Donker
  • PACKAGE, METHOD OF MANUFACTURING A PACKAGE AND FRAME
    Publication number: 20100051345
    Abstract: The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame contact pads outside the die attach area with connecting elements. The chip, the connecting elements and the frame contact pads outside the die attach area are anchored in an electrically insulating encapsulation. The frame contact pads each comprise a first patterned layer and a second patterned layer, which second layer has the surface that is exposed outside the encapsulation. At least a portion of the frame contact first patterned layer with a first pattern that comprises at least one flange/lead that is outside the second patterned layer when seen in perpendicular projection of the first layer on the second layer.
    Type: Application
    Filed: April 8, 2008
    Publication date: March 4, 2010
    Applicant: NXP, B.V.
    Inventors: Leonardus A. E. Van Gemert, Marcus F. Donker