Abstract: The present disclosure relates to a molded radiofrequency, ‘RF’, power package. The present disclosure further relates to a method for manufacturing such package. According to example embodiments, weakening structures are provided in the leads to allow the leads to be bent without causing delamination in the body of solidified molding compound.

Abstract: The present invention relates to a molded air-cavity package. In addition, the present invention is related to a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency ‘RF’ applications including but not limited to RF power amplifiers. Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.

Abstract: The present disclosure relates to a molded radiofrequency, ‘RF’, power package. The present disclosure further relates to a method for manufacturing such package.

Abstract: The present invention relates to a molded air-cavity package. In addition, the present invention is related to a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency ‘RF’ applications including but not limited to RF power amplifiers. Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.

Abstract: Integrated circuit package including an integrated circuit, external connection elements (3) connected to the integrated circuit, a package material (2) enclosing the integrated circuit, and a mechanical element (5, 6, 7) allowing a mechanical connection of a further element to the integrated circuit package (1). The mechanical element (5, 6, 7) is e.g. an attachment element (5); a mechanical element (5), optionally with a thread; a bushing element; a bearing element (7); an electrical connector (6).

Abstract: Integrated circuit package including an integrated circuit, external connection elements (3) connected to the integrated circuit, a package material (2) enclosing the integrated circuit, and a mechanical element (5, 6, 7) allowing a mechanical connection of a further element to the integrated circuit package (1). The mechanical element (5, 6, 7) is e.g. an attachment element (5); a mechanical element (5), optionally with a thread; a bushing element; a bearing element (7); an electrical connector (6).

Abstract: Package (1) having a sensor assembly (2) with at least one sensitive surface (21) and an attachment surface (22), a carrier element (3) with a sensor attachment area (31), and a sensor attach material (4) for attaching the sensor assembly (2) to the sensor attachment area (31) of the carrier element. The package (1) comprises an encapsulation (5) of a first material, in which the encapsulation (5) covers the sensor attachment area (31) of the carrier element (3) and the sensor attach material (4) and leaves the at least one sensitive surface (21) free from the first material.

Abstract: Package for an integrated circuit (IC), includes a housing (3) of a first material having two major surfaces (4, 5). The major surfaces are substantially parallel to each other. Furthermore, a lead frame (6) is present for carrying the IC (2), the lead frame (6) including contact terminals (7) for electrical communication with the IC (2). The package (1) has a through-hole (8) in the two major surfaces (4, 5), allowing various special applications of the package (1).

Abstract: Package (1) having a sensor assembly (2) with at least one sensitive surface (21) and an attachment surface (22), a carrier element (3) with a sensor attachment area (31), and a sensor attach material (4) for attaching the sensor assembly (2) to the sensor attachment area (31) of the carrier element. The package (1) comprises an encapsulation (5) of a first material, in which the encapsulation (5) covers the sensor attachment area (31) of the carrier element (3) and the sensor attach material (4) and leaves the at least one sensitive surface (21) free from the first material.

Abstract: Package for an integrated circuit (IC), includes a housing (3) of a first material having two major surfaces (4, 5). The major surfaces are substantially parallel to each other. Furthermore, a lead frame (6) is present for carrying the IC (2), the lead frame (6) including contact terminals (7) for electrical communication with the IC (2). The package (1) has a through-hole (8) in the two major surfaces (4, 5), allowing various special applications of the package (1).

Abstract: Method for encapsulating a chip with encapsulant, one portion of the surface of which chip must remain free of encapsulant, comprising the following steps: fixing the chip on a carrier with a suitable conductor structure, placing carrier and chip in one part of a mould, positioning a material on the mould or the chip surface, such that this material is clamped between the chip and mould after the mould has been closed, closing the mould, introducing the encapsulant and at least partially curing the encapsulant. The material is a heat-resistant moulding, having dimensions in the directions parallel to the surface of the chip such that an accurately delimited portion of the chip surface will be covered when the mould is closed, and a dimension in the direction perpendicular to the chip surface determined by the distance between the mould surface and the free portion of the chip surface.