Abstract: Provided are chrome-free adhesion pretreatment processes for use on a variety of reinforced or unreinforced plastics and polymers, such as polyimides, polyetherimides and polyvinylchloride. The pretreatment process can be performed in a combination of two sequential operations, which includes treating with a first solution containing nitric acid and subsequently treating with a second solution that includes sulfuric acid and periodate ions. Alternatively, the pretreatment process can be performed by treatment with a single combined composition that includes nitric acid, sulfuric acid, and periodate ions. The pretreatment processes, either done in two separate solutions, sequentially, or in one combined solution, produce an adherent surface for further metallization of the article, with adhesional values of the metal layer higher than those achieved using conventional chromic acid pretreatment processes.

Abstract: A process of enhancing surface adhesion of polyetherimides for metal plating includes contacting sulfuric acid with a surface of a polyetherimide substrate for a first dwell time to form a pre-etched polyetherimide substrate, contacting the pre-etched polyetherimide substrate with a mixture of sulfuric acid and periodate ions for a dwell time to form an oxidized polyetherimide surface, contacting the oxidized polyetherimide surface with an alkaline metal hydroxide solution for a third dwell time without rinsing between the applying steps or between the applying and contacting steps, where the polyetherimide is free of or includes a low volume percentage of reinforcement particles, and the process does not include contacting the polyetherimide substrate with nitric acid in any step.

Abstract: The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metallic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70° C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min.

Abstract: The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metalic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70° C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min.

Abstract: Provided are chrome-free adhesion pretreatment processes for use on a variety of reinforced or unreinforced plastics and polymers, such as polyimides, polyetherimides and polyvinylchloride. The pretreatment process can be performed in a combination of two sequential operations, which includes treating with a first solution containing nitric acid and subsequently treating with a second solution that includes sulfuric acid and periodate ions. Alternatively, the pretreatment process can be performed by treatment with a single combined composition that includes nitric acid, sulfuric acid, and periodate ions. The pretreatment processes, either done in two separate solutions, sequentially, or in one combined solution, produce an adherent surface for further metallization of the article, with adhesional values of the metal layer higher than those achieved using conventional chromic acid pretreatment processes.

Abstract: The present invention relates to the etching, activation and deposition of a first metal or metal alloy layer onto non-conductive polymers. The non-conductive polymer is etched with an aqueous solution comprising 0.75 to 3.6 g/l permanganate ions in 60 to 80 vol.-% sulfuric acid, activating with a solution comprising a noble metal and depositing a first metal or metal alloy by immersion-type or electroless (autocatalytic) plating. The first metal or metal alloy layer obtained has a high adhesion on the non-conductive polymer and serves as a plating base for electroplating further metal and/or metal alloy layer(s) thereon.

Abstract: The present invention relates to the etching, activation and deposition of a first metal or metal alloy layer onto non-conductive polymers. The non-conductive polymer is etched with an aqueous solution comprising 0.75 to 3.6 g/l permanganate ions in 60 to 80 vol.-% sulfuric acid, activating with a solution comprising a noble metal and depositing a first metal or metal alloy by immersion-type or electroless (autocatalytic) plating. The first metal or metal alloy layer obtained has a high adhesion on the non-conductive polymer and serves as a plating base for electroplating further metal and/or metal alloy layer(s) thereon.

Abstract: The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of hexavalent chromium. The etching solution is based on an sulphuric acidic solution comprising a source of chlorate ions and a vanadium compound. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.

Abstract: The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of both trivalent chromium and hexavalent chromium. The etching solution is based on an sulphuric acidic solution containing a source of chlorate ions. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.

Abstract: A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treated with a metal salt solution, containing at least one salt from the group consisting of a cobalt salt, a silver salt, a tin salt, and a lead salt. The plastic surface is treated with a sulfide solution. Finally, the plastic surface is metallized in a metallizing bath.

Abstract: A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treated with a metal salt solution, containing at least one salt from the following group: cobalt salt, silver salt, tin salt, and lead salt. The plastic surface is treated with a sulfide solution. Finally, the plastic surface is metallized in a metallizing bath.