Patents by Inventor Leonel R. Arane

Leonel R. Arane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100258927
    Abstract: Embodiments of the invention relate to a package-on-package (PoP) assembly comprising a top device package and a bottom device package interconnected by way of an electrically interconnected planar stiffener. Embodiments of the invention include a first semiconductor package having a plurality of inter-package contact pads and a plurality of second level interconnect (SLI) pads; a second semiconductor package having a plurality of SLI pads on the bottom side of the package; and a planar stiffener having a first plurality of planar contact pads on the top side of the stiffener electrically connected to the SLI pads of the second package, and a second plurality of planar contact pads electrically connected to the inter-package contact pads of the first package.
    Type: Application
    Filed: April 10, 2009
    Publication date: October 14, 2010
    Inventors: Sanka Ganesan, Yosuke Kanaoka, Ram S. Viswanath, Rajasekaran Swaminathan, Robert M. Nickerson, Leonel R. Arane, John S. Guzek, Yoshihiro Tomita