Patents by Inventor Leonhard Botzenhardt

Leonhard Botzenhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contact system for semiconductor arrangement
    Patent number: 4005456
    Abstract: A semiconductor arrangement comprises a semiconductor body with a metal layer thereon whose exterior surface is vapor deposited or sputtered gold, a layer of palladium on the metal layer and a connecting region of electrolytically deposited gold on the palladium layer.
    Type: Grant
    Filed: February 10, 1975
    Date of Patent: January 25, 1977
    Assignee: Licentia Patent-Verwaltungs-G.m.b.H.
    Inventor: Leonhard Botzenhardt
  • Method of producing a semiconductor arrangement
    Patent number: 3935635
    Abstract: A method of producing a semiconductor arrangement comprises electrolytically depositing a thickening onto a metal layer, at the contact points for the semiconductor arrangement, which metal layer is intended to eventually form conducting paths for the semiconductor arrangement and effectively covers the relevant semiconductor body surface.
    Type: Grant
    Filed: March 22, 1974
    Date of Patent: February 3, 1976
    Assignee: Licentia Patent-Verwaltungs-G.m.b.H.
    Inventor: Leonhard Botzenhardt