Patents by Inventor Leonhard Heiss

Leonhard Heiss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10693450
    Abstract: An apparatus is provided which comprises: a dual stack voltage driver, wherein the dual stack voltage driver comprises a first stack of transistors, and a second stack of transistors; and one or more feedback transistors each coupled to a transistor of the second stack of transistors.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: June 23, 2020
    Assignee: Intel IP Corporation
    Inventors: Dharmaray Nedalgi, Karthik Ns, Vani Deshpande, Leonhard Heiss
  • Patent number: 10527668
    Abstract: An apparatus for predicting a future state of an electronic component is provided. The apparatus includes a measuring unit configured to measure a waveform of a signal related to the electronic component. Further, the apparatus includes a processing unit configured to calculate a predicted value of a characteristic of the electronic component based on a reliability model of the electronic component using the waveform of the signal.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: January 7, 2020
    Assignee: Intel IP Corporation
    Inventors: Leonhard Heiss, Andreas Lachmann, Reiner Schwab
  • Publication number: 20200007120
    Abstract: An apparatus is provided which comprises: a dual stack voltage driver, wherein the dual stack voltage driver comprises a first stack of transistors, and a second stack of transistors; and one or more feedback transistors each coupled to a transistor of the second stack of transistors.
    Type: Application
    Filed: June 28, 2018
    Publication date: January 2, 2020
    Applicant: Intel IP Corporation
    Inventors: Dharmarayi Nedalgi, Karthik NS, Vani Deshpande, Leonhard Heiss
  • Patent number: 10128248
    Abstract: An apparatus is provided which comprises: a stack of transistors of a same conductivity type, the stack including a first transistor and a second transistor coupled in series and having a common node; and a feedback transistor of the same conductivity type coupled to the common node and a gate terminal of the first transistor of the stack.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: November 13, 2018
    Assignee: Intel Corporation
    Inventors: Karthik Ns, Dharmaray Nedalgi, Vani Deshpande, Leonhard Heiss, Amit Kumar Srivastava
  • Publication number: 20180231601
    Abstract: An apparatus for predicting a future state of an electronic component is provided. The apparatus includes a measuring unit configured to measure a waveform of a signal related to the electronic component. Further, the apparatus includes a processing unit configured to calculate a predicted value of a characteristic of the electronic component based on a reliability model of the electronic component using the waveform of the signal.
    Type: Application
    Filed: June 21, 2016
    Publication date: August 16, 2018
    Inventors: Leonhard Heiss, Andreas Lachmann, Reiner Schwab