Patents by Inventor Leoni WILHELM

Leoni WILHELM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12162804
    Abstract: One aspect relates to a process for producing a sintered workpiece, which includes sintering of a ceramic material at a temperature of at least 1000° C. and in an atmosphere, in the case of which the partial pressure of atmospheric air is reduced to less than 10?6-times, based on the ambient air at the same temperature under equilibrium conditions.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: December 10, 2024
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Leoni Wilhelm, Ulrich Hausch, Robert Dittmer
  • Publication number: 20240325729
    Abstract: One aspect refers to a lead for a medical device, including a cable comprising an outer insulation having at least one first opening near a distal end of the cable and an inner lumen. The inner lumen is arranged coaxially to the outer insulation. At least one conducting channel is arranged between the outer insulation and the inner lumen. The at least one conducting channel is formed by at least one insulated conductor. The insulation layer comprises a second opening, which is aligned with the at least one first opening. At least one ring electrode surrounds the cable at a position of the at least one aligned first and second opening of the cable. The at least one ring electrode is selectively connected to the conductor of the at least one insulated conductor via a bendable bridging element extending through the at least one aligned first and second opening.
    Type: Application
    Filed: March 22, 2024
    Publication date: October 3, 2024
    Applicant: Heraeus Medevio GmbH & Co. KG
    Inventors: Leoni WILHELM, Mark A. HJELLE, Michael SEFFREN, Andreas REISINGER
  • Patent number: 11944830
    Abstract: One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 2, 2024
    Assignees: Heraeus Deutschland GmbH & Co. KG, Heraeus Additive Manufacturing GmbH
    Inventors: Beytullah Yasin Kilic, Leoni Wilhelm, Jakob Fischer, Jens Trötzschel
  • Publication number: 20210403388
    Abstract: One aspect relates to a process for producing a sintered workpiece, which includes sintering of a ceramic material at a temperature of at least 1000° C. and in an atmosphere, in the case of which the partial pressure of atmospheric air is reduced to less than 10?6-times, based on the ambient air at the same temperature under equilibrium conditions.
    Type: Application
    Filed: June 14, 2021
    Publication date: December 30, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Leoni WILHELM, Ulrich HAUSCH, Robert DITTMER
  • Publication number: 20210330984
    Abstract: One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 28, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Beytullah Yasin KILIC, Leoni WILHELM, Jakob FISCHER, Jens TRÖTZSCHEL
  • Patent number: 10293172
    Abstract: One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: May 21, 2019
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert Dittmer, Senthil Kumar Balasubramanian, Leoni Wilhelm, Thomas Schmitt, Thorsten Kaiser, Tim Asmus
  • Publication number: 20170291033
    Abstract: One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.
    Type: Application
    Filed: April 4, 2017
    Publication date: October 12, 2017
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Robert DITTMER, Senthil Kumar BALASUBRAMANIAN, Leoni WILHELM, Thomas SCHMITT, Thorsten KAISER, Tim ASMUS