Abstract: A modular electronic cooling system with moving parts, composed of a base unit and individual modules inserted into this base unit in respect to the expected upper limit of the heat load may utilize thermoelectric power generation and the heat load itself to allow for operation independent of any external power source. By the same mechanism the cooling system scales within a range automatically reacting to and dissipating a dynamic heat load via forced convection, and doing so passively, without the need for specific programming. This cooling system uses porous material or multi-layered mesh parts, thermoelectric components, a modular assembly system and independent enclosure parts for described porous material or multi-layered mesh, an electronics control system that may be passively activated, and a motor assembly. Altogether the system provides maximum efficiency in terms of form factor.

Abstract: A modular electronic cooling system with moving parts, composed of a base unit and individual modules inserted into this base unit in respect to the expected upper limit of the heat load is presented. This cooling system utilizes thermoelectric power generation and the heat load itself to allow for operation independent of any external power source. By the same mechanism the cooling system scales within a range beyond initial configuration, automatically reacting to and dissipating a dynamic heat load via forced convection, and doing so passively, without the need for specific programming. The said cooling system comprises of porous material or multi-layered mesh parts, thermoelectric components, a modular assembly system and independent enclosure parts for described porous material or multi-layered mesh, an electronics control system that may be passively activated, and a motor assembly. Altogether the system provides maximum efficiency in terms of form factor.

Abstract: An energy efficient cryocooler is disclosed that cools a large area with multiple cooling temperatures on multiple cooled area working in parallel for the maximum cryogenic cooling and “over-clocking” of microprocessors and computer components using liquid and/or gaseous refrigerants in phase change. A cryogenic cooling system provides simultaneous steady stream (or pulse) cryocooling of a computer components with each part of the computer system receiving cooling at it's optimum temperature. The system comprises an evaporator with liquid and gaseous refrigerant which evaporator is placed onto the microprocessor to disperse heat from said microprocessor and a enclosure around the cooled system that cools all other components in one stage. The use of the invented cryocooling system resulted in the increase 2.4 GHz “Celeron D” microprocessor frequency to 4.78 GHz. The RAM was also overclocked to 60 MHz above normal on a test system.