Patents by Inventor Leonid Akhtman
Leonid Akhtman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8957756Abstract: A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.Type: GrantFiled: August 19, 2013Date of Patent: February 17, 2015Assignee: Vishay Intertechnology, Inc.Inventors: Michael Belman, Leonid Akhtman
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Publication number: 20130335191Abstract: A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.Type: ApplicationFiled: August 19, 2013Publication date: December 19, 2013Applicant: Vishay Intertechnology, Inc.Inventors: Michael Belman, Leonid Akhtman
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Patent number: 8514051Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.Type: GrantFiled: July 18, 2011Date of Patent: August 20, 2013Assignee: Vishay Intertechnology, Inc.Inventors: Michael Belman, Leonid Akhtman
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Publication number: 20120126934Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.Type: ApplicationFiled: July 18, 2011Publication date: May 24, 2012Applicant: VISHAY INTERTECHNOLOGY, INC.Inventors: Michael Belman, Leonid Akhtman
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Patent number: 7982582Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.Type: GrantFiled: February 13, 2008Date of Patent: July 19, 2011Assignee: Vishay Intertechnology Inc.Inventors: Michael Belman, Leonid Akhtman
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Publication number: 20080211619Abstract: A chip resistor includes an insulating substrate 11, top terminal electrodes 12 formed on top surface of the substrate using silver-based cermet, bottom electrodes 13, resistive element 14 that is situated between the top terminal electrodes 12 and overlaps them partially, an optional internal protective coating 15 that covers resistive element 14 completely or partially, an external protective coating 16 that covers completely the internal protection coating 15 and partially covers top terminal electrodes 12, a plated layer of nickel 17 that covers face sides of the substrate, top 12 and bottom 13 electrodes, and overlaps partially external protective coating 16, finishing plated layer 18 that covers nickel layer 17. The overlap of nickel layer 17 and external protective layer 16 possesses a sealing property because of metallization of the edges of external protective layer 16 prior to the nickel plating process.Type: ApplicationFiled: February 13, 2008Publication date: September 4, 2008Applicant: VISHAY INTERTECHNOLOGY, INC.Inventors: Michael Belman, Leonid Akhtman
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Patent number: 7089652Abstract: The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.Type: GrantFiled: May 19, 2003Date of Patent: August 15, 2006Assignee: Vishay Intertechnology, Inc.Inventors: Leonid Akhtman, Sakaev Matvey
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Patent number: 6727798Abstract: The present invention provides for a flip chip resistor having a substrate having opposite ends, a pair of electrodes formed from a first electrode layer disposed on the opposite ends of the substrate, a resistance layer electrically connecting the pair of electrodes, a protective layer overlaying the resistance layer, and a second electrode layer overlaying the first electrode layer and at least a portion of the protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.Type: GrantFiled: September 3, 2002Date of Patent: April 27, 2004Assignee: Vishay Intertechnology, Inc.Inventors: Leonid Akhtman, Sakaev Matvey
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Publication number: 20040041688Abstract: The present invention provides for a flip chip resistor having a substrate having opposite ends, a pair of electrodes formed from a first electrode layer disposed on the opposite ends of the substrate, a resistance layer electrically connecting the pair of electrodes, a protective layer overlaying the resistance layer, and a second electrode layer overlaying the first electrode layer and at least a portion of the protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.Type: ApplicationFiled: September 3, 2002Publication date: March 4, 2004Inventors: Leonid Akhtman, Sakaev Matvey
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Publication number: 20040041278Abstract: The present invention provides for a flip chip resistor having a substrate having opposite ends, a pair of electrodes formed from a first electrode layer disposed on the opposite ends of the substrate, a resistance layer electrically connecting the pair of electrodes, a protective layer overlaying the resistance layer, and a second electrode layer overlaying the first electrode layer and at least a portion of the protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.Type: ApplicationFiled: May 19, 2003Publication date: March 4, 2004Applicant: Vishay Intertechnology, Inc.Inventors: Leonid Akhtman, Sakaev Matvey
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Patent number: 5248298Abstract: An insert is provided to be attached to a shield on a surgical trocar obturator handle. The insert is actuated by the surgical trocar cannula handle so that it causes the shield to expose the sharpened obturator tip after insertion of the obturator and shield within the cannula. After usage, the insert is deactivated so that the shield again covers the obturator. The obturator can then be removed from the cannula handle and obturator shield, and the obturator handle can be discarded safely.Type: GrantFiled: April 16, 1992Date of Patent: September 28, 1993Assignee: Ethicon, Inc.Inventors: James Bedi, Steven Annunziato