Abstract: A circuit board design uses CMOS sensors for the tip section of a multi-viewing element endoscope. Side sensors and their optical assemblies are assembled to a common base board to save space. Individual base boards are separately constructed, inserted into grooves of a main base board, and are further connected to the main base board by means of flexible circuit boards.

Abstract: The subject matter disclosed in the present invention discloses a medical imaging device comprising at least two cameras. The medical imaging device comprises an elongated and narrow distal tip connected to a rigid elongated shaft member, wherein the distal tip can comprise a front camera and a first side camera. The cameras of the disclosed medical imaging device can be configured to provide variable cameras' magnifications, which in some cases may vary from one camera to another. The distal tip can comprise some optical gear required for the medical procedures. The optical gear located in the distal tip can comprise cameras, lenses and light sources required for the camera functioning. The cameras of the medical imaging device may be provided with dissimilarity in the cameras' magnification factors. Such dissimilarities are used to show the same object in the same size in a panoramic image captured simultaneously by multiple cameras, as the multiple cameras have multiple distances to the object.

Abstract: There is provided herein, an electronic circuit board assembly for a tip section of a multiple viewing elements endoscope, the assembly including a base board configured to carry a first metal frame to support a front looking viewing element and a second metal frame to support a side looking viewing element; and a flexible illumination circuit board comprising a front foldable panel configured to carry three sets of front illuminators for essentially illuminating the field of view (FOV) of the front looking viewing element, and a side foldable panel configured to carry a set of side illuminators for essentially illuminating the field of view (FOV) of the side looking viewing element.

Abstract: The present specification is directed towards endoscopes, such as colonoscopes, that provide a broader field of view and allow extended access of surgical tools and also enable efficient packing of all necessary elements in the tip section, while maintaining their functionality. Also described are methods and systems for capturing and displaying still and video images using an endoscope corresponding to a left-side looking, a front-looking and a right-side looking viewing element of an endoscopic tip generated in a native aspect ratio.

Abstract: A circuit board design uses CMOS sensors for the tip section of a multi-viewing element endoscope. Side sensors and their optical assemblies are assembled to a common base board to save space. Individual base boards are separately constructed, inserted into grooves of a main base board, and are further connected to the main base board by means of flexible circuit boards.

Abstract: An optical assembly adapted to be positioned within an endoscope tip and having three modular camera units, comprising: a front modular camera unit defined by a front central axis and a first and second side modular camera units defined by first and second side central axes that are substantially parallel to one another and substantially perpendicular to the front central axis. Each modular camera unit further comprises a holder for housing an associated optical element and an image sensor in data communication with a corresponding printed circuit board. The front, first side and second side modular camera units are respectively positioned in first, second and third compartments of an assembly holder.

Abstract: An image capturing assembly for use in an endoscope includes a manifold with a base and a casing extending outward from the base, a partially enclosed housing adapted to physically attach to the manifold, a foldable LED carrier substrate capable of carrying a plurality of LEDs, a flexible optical carrier substrate capable of carrying a plurality of camera sensors, and a tip cover adapted to cover the manifold, housing, LED carrier substrate, and optical carrier substrate. The manifold includes at least one continuous channel extending throughout its length. The foldable LED carrier substrate includes a central, forward facing portion, adapted to carry at least one illuminator for a front viewing element, and a pair of arms extending proximally from the central portion. Each arm includes at least one foldable protrusion adapted to carry an illuminator for a side viewing element.

Abstract: The present specification describes a circuit board design that uses circuit boards for illuminator sets associated with the various optical assemblies. In one configuration, front and side illuminators are assembled on front and side illuminator circuit boards. Leaf connectors associated with each illuminator are provided to interface with a common base board.

Abstract: There is provided herein, an electronic circuit board assembly for a tip section of a multiple viewing elements endoscope, the assembly including a base board configured to carry a first metal frame to support a front looking viewing element and a second metal frame to support a side looking viewing element; and a flexible illumination circuit board comprising a front foldable panel configured to carry three sets of front illuminators for essentially illuminating the field of view (FOV) of the front looking viewing element, and a side foldable panel configured to carry a set of side illuminators for essentially illuminating the field of view (FOV) of the side looking viewing element.

Abstract: The present specification describes a novel system for dynamically modifying the magnification power of optical devices used in high performance and critical applications such as medical procedures. The present specification describes an optical imaging system having a magnification control system connected to a sensor device for enabling movement of sensor device with respect to a lens assembly of the imaging system, wherein distance between the sensor device and the lens assembly is altered to enable different levels of magnification capability.

Abstract: The present specification describes a novel system for dynamically modifying the magnification power of optical devices used in high performance and critical applications such as medical procedures. The present specification describes an optical imaging system having a magnification control system connected to a sensor device for enabling movement of sensor device with respect to a lens assembly of the imaging system, wherein distance between the sensor device and the lens assembly is altered to enable different levels of magnification capability.

Abstract: A circuit board design uses CMOS sensors for the tip section of a multi-viewing element endoscope. Side sensors and their optical assemblies are assembled to a common base board to save space. Individual base boards are separately constructed, inserted into grooves of a main base board, and are further connected to the main base board by means of flexible circuit boards.

Abstract: The present specification describes an endoscopy display system including an endoscope with a distal tip having at least three image capturing components, and a handle with an actuator that, when activated, generates a video processing command; a controller including a video processing system adapted to transmit commands to the three image capturing components and receive an image feed from each of said three image capturing components; and a display system, including at least one monitor that concurrently receives and concurrently visually displays each of said processed image feeds, where the video processing system is adapted to process each of said image feeds in accordance with the video processing command to cause at least one of changing a position of, zooming into or out of; recording; freezing; highlighting; or superimposing a navigation indicator upon the at least one of the processed image feeds.

Abstract: A circuit board design uses CMOS sensors for the tip section of a multi-viewing element endoscope. Side sensors and their optical assemblies are assembled to a common base board to save space. Individual base boards are separately constructed, inserted into grooves of a main base board, and are further connected to the main base board by means of flexible circuit boards.

Abstract: The present specification is directed towards endoscopes, such as colonoscopes, that provide a broader field of view and allow extended access of surgical tools and also enable efficient packing of all necessary elements in the tip section, while maintaining their functionality. Also described are methods and systems for capturing and displaying still and video images using an endoscope corresponding to a left-side looking, a front-looking and a right-side looking viewing element of an endoscopic tip generated in a native aspect ratio.

Abstract: An optical assembly adapted to be positioned within an endoscope tip and having three modular camera units, comprising: a front modular camera unit defined by a front central axis and a first and second side modular camera units defined by first and second side central axes that are substantially parallel to one another and substantially perpendicular to the front central axis. Each modular camera unit further comprises a holder for housing an associated optical element and an image sensor in data communication with a corresponding printed circuit board. The front, first side and second side modular camera units are respectively positioned in first, second and third compartments of an assembly holder.

Abstract: The present specification describes a novel system for dynamically modifying the magnification power of optical devices used in high performance and critical applications such as medical procedures. The present specification describes an optical imaging system having a magnification control system connected to a sensor device for enabling movement of sensor device with respect to a lens assembly of the imaging system, wherein distance between the sensor device and the lens assembly is altered to enable different levels of magnification capability.

Abstract: The present specification is directed towards endoscopes, such as colonoscopes, that provide a broader field of view and allow extended access of surgical tools and also enable efficient packing of all necessary elements in the tip section, while maintaining their functionality. Also described are methods and systems for capturing and displaying still and video images using an endoscope corresponding to a left-side looking, a front-looking and a right-side looking viewing element of an endoscopic tip generated in a native aspect ratio.

Abstract: The present specification describes an endoscopy display system including an endoscope with a distal tip having at least three image capturing components, and a handle with an actuator that, when activated, generates a video processing command; a controller including a video processing system adapted to transmit commands to the three image capturing components and receive an image feed from each of said three image capturing components; and a display system, including at least one monitor that concurrently receives and concurrently visually displays each of said processed image feeds, where the video processing system is adapted to process each of said image feeds in accordance with the video processing command to cause at least one of changing a position of, zooming into or out of; recording; freezing; highlighting; or superimposing a navigation indicator upon the at least one of the processed image feeds.

Abstract: An optical assembly adapted to be positioned within an endoscope tip and having three modular camera units, comprising: a front modular camera unit defined by a front central axis and a first and second side modular camera units defined by first and second side central axes that are substantially parallel to one another and substantially perpendicular to the front central axis. Each modular camera unit further comprises a holder for housing an associated optical element and an image sensor in data communication with a corresponding printed circuit board. The front, first side and second side modular camera units are respectively positioned in first, second and third compartments of an assembly holder.