Abstract: A simulation and emulation system for critical infrastructure comprising one or more components, the system comprising at least one processing circuitry configured to: obtain a model including: a plurality of Dynamic Digital Emulation Models (DDEMs), and one or more operational procedures configured to cause reconfiguration of one or more of the DDEMs upon events taking place; execute one or more scenarios comprised of a sequence of one or more actions on the model, at least one of the actions causes triggering at least one of the events, thereby causing changes to one or more of parameters of one or more first DDEMs of the DDEMs, the changes triggers execution of one or more operational procedures, thereby causing reconfiguration of one or more second DDEMs of the DDEMs; analyze the model to identify implications of the scenarios execution; and perform one or more actions based on results of the analysis.

Abstract: Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.

Abstract: Exemplary embodiments are disclosed of thermal management assemblies suitable for use (e.g., configured for heat spreading, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP+ transceivers, quad small form-factor pluggable (QSFP) transceivers QSFP+ transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.). In exemplary embodiments, a thermal management assembly comprises at least one flexible heat spreading material (e.g., a single graphite sheet, multiple graphite sheets, etc.) including portions wrapped (e.g., in different non-parallel directions, in parallel directions, etc.) around corresponding portions of a part, which may be configured to be coupled to and/or along a side of a device housing. The at least one flexible heat spreading material may be operable for defining at least a portion of a thermally-conductive heat path around the corresponding portions of the part.

Abstract: An apparatus for plastically deforming a work piece in the form of a sheet, comprising at least two cylindrical guide rolls rotatable in a first direction, each of said cylindrical guide rolls having an outer circumference; a bendable strip having a portion of at least one surface in communication with a portion of the outer circumference of each of the at least two guide rollers, said bendable strip being capable of motion around the at least two guide rollers in the first direction and exerting a force upon a work piece, a first cylindrical feeding roll rotatable in a second direction opposite to the first direction, said first cylindrical feeding roll having an outer circumference, a plastic deformation passage having a first surface and a second surface, at least a portion of the first surface being defined by a portion of the bendable strip, and at least a portion of the second surface being defined by the outer circumference of the first cylindrical feeding roll, wherein one or both of the bendable stri

Abstract: method for forming an aperture includes stamping an aperture into the article using a pellet, and refining aperture shape(s) and/or aperture dimensions. Methods for forming articles having reduced residual compressive stress are also disclosed. Very generally, the methods include establishing a diamond coating on at least a portion of a substrate, and applying a stress-relief process to the diamond coating, the substrate, or combinations thereof.

Abstract: Disclosed is a method of making a coated substrate, especially a diamond coated substrate. In one embodiment, the method includes depositing an interlayer on a substrate to create an interlayer surface, peening the interlayer surface with a peening compound to create a peened interlayer surface, and depositing a coating on the peened interlayer surface to create a coated substrate wherein the peening compound comprises particles of the coating. Also provided is a method of drilling a nonferrous substrate such as aluminum with no more than minimum lubricants. The method includes providing a diamond coated drill produced by the foregoing method, and moving the drill against a nonferrous substrate under sufficient force such that the drill cuts and removes a portion of the substrate, wherein the moving of the drill against the substrate occurs under minimum lubrication conditions.

Abstract: A method of surface treating heat treated members to remove oxide scale. The heat treated members are subjected to a staged series of discrete chemical and physical cleaning steps yielding a substantially scale-free surface readily adaptable for subsequent application of protective coatings.

Abstract: A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity and the intermediate material interposed contains at least one shape memory alloy, the shape memory alloy capable of exhibiting superelasticity.

Abstract: A diamond coated cutting tool is disclosed having a either steel or cemented carbide substrate. The interior layer disposed between the diamond coating and the substrate inhibits the diffusion of carbon and other species.