Abstract: Techniques for implementing an internal optical communication link in a power amplifier system are disclosed. In one embodiment, the techniques may be realized as a power amplifier system that includes a panel, an optical link, and a controller. The panel includes a plurality of signal endpoints and a first optical interface, the first optical interface being coupled to each of the plurality of signal endpoints. The optical link is coupled to the first optical interface. The controller is configured to manage operation of the power amplifier system and is coupled to the optical link via a second optical interface. The controller communicates with each of the plurality of signal endpoints over the optical link.

Abstract: Techniques for implementing an internal optical communication link in a power amplifier system are disclosed. In one embodiment, the techniques may be realized as a power amplifier system that includes a panel, an optical link, and a controller. The panel includes a plurality of signal endpoints and a first optical interface, the first optical interface being coupled to each of the plurality of signal endpoints. The optical link is coupled to the first optical interface. The controller is configured to manage operation of the power amplifier system and is coupled to the optical link via a second optical interface. The controller communicates with each of the plurality of signal endpoints over the optical link.

Abstract: Techniques for implementing an internal optical communication link in a power amplifier system are disclosed. In one embodiment, the techniques may be realized as a power amplifier system that includes a panel, an optical link, and a controller. The panel includes a plurality of signal endpoints and a first optical interface, the first optical interface being coupled to each of the plurality of signal endpoints. The optical link is coupled to the first optical interface. The controller is configured to manage operation of the power amplifier system and is coupled to the optical link via a second optical interface. The controller communicates with each of the plurality of signal endpoints over the optical link.

Abstract: In general, an RF power amplifier comprises a controller, a driver, a splitter, a final stage, and a combiner coupled together to function as the RF power amplifier. One or more of the above components are arranged on one or more motherboards, e.g., a printed circuit board (PCB). A heat sink defines a base of the RF power amplifier, and in some embodiments includes at least two grooves formed therein, wherein the electrical components of the splitter and electrical components of the controller fit within one or more of the grooves so that these components can substantially disposed within the heat sink. In some embodiments, a power rail is also provided, and is also disposed substantially within the heat sink. The power rail groove of the heat sink and the carrier of the final stage provide an EMI shield of the power rail.

Abstract: In general, an RF power amplifier comprises a controller, a driver, a splitter, a final stage, and a combiner coupled together to function as the RF power amplifier. One or more of the above components are arranged on one or more motherboards, e.g., a printed circuit board (PCB). A heat sink defines a base of the RF power amplifier, and in some embodiments includes at least two grooves formed therein, wherein the electrical components of the splitter and electrical components of the controller fit within one or more of the grooves so that these components can substantially disposed within the heat sink. In some embodiments, a power rail is also provided, and is also disposed substantially within the heat sink. The power rail groove of the heat sink and the carrier of the final stage provide an EMI shield of the power rail.